Inventor · disambiguated record
Kai Yang
Also filed as: YANG KAI · YANG KAI-CHENG
0 granted patents·3 pending applications·0 citations·filing 2004–2022
Top patents by PatentIndex Score
3 records- 0163US2024084135A1Resin composition, and prepreg, metal-clad laminate and printed circuit board prepared using the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0240US2006196283A1Measurement of Thickness Profile and Elastic Modulus Profile of a Polishing PadYANG KAI·Filed 2006·Application pending·0 cites
- 0337US2005090104A1Slurry compositions for chemical mechanical polishing of copper and barrier filmsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →