Inventor · disambiguated record
Katie C. Yu
Also filed as: YU KATIE · YU KATIE C
1 granted patent·1 pending application·27 citations·filing 2006–2006
43Inventor score
Top patents by PatentIndex Score
2 records- 0191US7276435B1Die level metal density gradient for improved flip chip package reliabilityFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 2, 2007·27 cites·20 claims
- 0239US2009301867A1Integrated system for semiconductor substrate processing using liquid phase metal depositionCITIBANK NA·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →