Inventor · disambiguated record
Kanako Yuasa
Also filed as: YUASA KANAKO
12 granted patents·21 citations·filing 2007–2021
88Inventor score
Files withHITACHI CHEMICAL CO LTD5SHENZHEN JUFEI OPTOELECTRONICS CO LTD5KOTANI HAYATO1URASAKI NAOYUKI1
Top patents by PatentIndex Score
12 records- 0194US10950767B2Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the sameSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·6 cites·11 claims
- 0294US10326063B2Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 18, 2019·7 cites·12 claims
- 0392US10205072B2Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 12, 2019·5 cites·18 claims
- 0478US11984545B2Method of manufacturing a light emitting deviceSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·0 cites·5 claims
- 0575US12426415B2Method of manufacturing an optical semiconductor deviceSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2021·Granted Sep 23, 2025·0 cites·21 claims
- 0675US12317657B2Optical semiconductor element mounting package and optical semiconductor device using the sameSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2021·Granted May 27, 2025·0 cites·14 claims
- 0774US11810778B2Optical semiconductor element mounting package and optical semiconductor device using the sameSHENZHEN JUFEI OPTOELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·21 claims
- 0870US9387608B2Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin compositionKOTANI HAYATO·Filed 2007·Granted Jul 12, 2016·2 cites·20 claims
- 0968US9608184B2Optical semiconductor element mounting package, and optical semiconductor device using the sameURASAKI NAOYUKI·Filed 2011·Granted Mar 28, 2017·1 cites·10 claims
- 1064US10381533B2Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflectionHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 13, 2019·0 cites·14 claims
- 1160US9076932B2Optical semiconductor element mounting package, and optical semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2014·Granted Jul 7, 2015·0 cites·18 claims
- 1259US9660156B2Optical semiconductor element mounting package, and optical semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted May 23, 2017·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →