Inventor · disambiguated record
Kai Jun Zhan
Also filed as: ZHAN KAI · ZHAN KAI JUN
18 granted patents·12 pending applications·9 citations·filing 2017–2025
89Inventor score
Top patents by PatentIndex Score
30 records- 0195US11101233B1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 24, 2021·4 cites·20 claims
- 0294US12015002B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·2 cites·20 claims
- 0387US2025364468A1Semiconductor device structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0484US2025336884A1Package bonding structures and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0583US12463166B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0683US2025323201A1Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0782US12444706B2Package bonding structures and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0882US12412858B2Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 0982US2025316632A1Semiconductor die including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1081US12381171B2Semiconductor die including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 1179US10283471B1Micro-connection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·2 cites·20 claims
- 1278US2025349791A1Systems for fluxless bonding using an atmospheric pressure plasma and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1375US11004685B2Multi-layer structures and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·1 cites·20 claims
- 1471US11990440B2Structure and formation method of semiconductor device with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 1570US12506109B2Die bonding tool with tiltable bond head for improved bonding and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 1670US11978720B2Semiconductor device package and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 1770US11887955B2Semiconductor die including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 1868US11942445B2Semiconductor device with conductive padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 1967US11152319B2Micro-connection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·20 claims
- 2066US11961817B2Apparatus and method for forming a package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2164US11742204B2Multi-layer structures and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 2262US10651142B2Micro-connection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 12, 2020·0 cites·20 claims
- 2361US11909368B2Dual mode notch filterQUALCOMM INC·Filed 2021·Granted Feb 20, 2024·0 cites·30 claims
- 2459US2025385649A1Inductively coupled multi-stack amplifierQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2557US2023369049A1Multi-Layer Structures and Methods of FormingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2655US2024404989A1Parallel plasma treatment and thermocompression bonding and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2755US2025132284A1Die bonding tool with tiltable bond stage and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2855US2024404988A1Fluxless die bonding using in-situ plasma treatment and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2952US2025096754A1Transceiver interface with power detectionQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3046US2021332102A1High-affinity t cell receptor against prameGUANGDONG XIANGXUE LIFE SCIENCES LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →