Inventor · disambiguated record
Keisuke Akashi
Also filed as: AKASHI KEISUKE
1 granted patent·2 pending applications·0 citations·filing 2015–2020
9Inventor score
Top patents by PatentIndex Score
3 records- 0147US12157189B2Junction structure, method for manufacturing junction structure, and solder ballNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2020·Granted Dec 3, 2024·0 cites·16 claims
- 0234US2017209964A1Solder ball and electronic memberNIPPON STEEL & SUMIKIN MAT CO·Filed 2015·Application pending·0 cites
- 0328US2017259366A1Lead-free solder bump joining structureNIPPON STEEL & SUMIKIN MAT CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →