Inventor · disambiguated record
Kei Anai
Also filed as: ANAI KEI
10 granted patents·8 pending applications·19 citations·filing 2005–2023
80Inventor score
Top patents by PatentIndex Score
18 records- 0185US8043535B2Conductive inkMITSUI MINING & SMELTING CO·Filed 2005·Granted Oct 25, 2011·17 cites·1 claims
- 0270US11195635B2Conductive film manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2018·Granted Dec 7, 2021·1 cites·4 claims
- 0367US11931808B2Bonding composition, conductor bonding structure, and method for producing sameMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Mar 19, 2024·1 cites·14 claims
- 0461US12263523B2Method for producing bonding compositionMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Apr 1, 2025·0 cites·8 claims
- 0555US12046572B2Bonding sheet and bonded structureMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·7 claims
- 0655US2025162087A1Bonded body manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2023·Application pending·0 cites
- 0755US2025201764A1Method for manufacturing bonded body and method for bonding bodies to be bondedMITSUI MINING & SMELTING CO LTD·Filed 2023·Application pending·0 cites
- 0853US2025219005A1Copper paste for joining, method for joining body to be joined, method for producing joined body, and method for producing copper paste for joiningMITSUI MINING & SMELTING CO LTD·Filed 2023·Application pending·0 cites
- 0951US12012523B2Conductive film formation composition and method for manufacturing conductive filmMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Jun 18, 2024·0 cites·14 claims
- 1051US2025149492A1Copper paste for pressure bonding, semiconductor device, method for preparing copper paste for pressure bonding, and method for manufacturing semiconductor deviceMITSUI MINING & SMELTING CO LTD·Filed 2023·Application pending·0 cites
- 1150US12070801B2Bonding material and bonded structureMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Aug 27, 2024·0 cites·12 claims
- 1250US2024149340A1Joint structureMITSUI MINING & SMELTING CO LTD·Filed 2022·Application pending·0 cites
- 1348US12233463B2Composition for pressure bonding, and bonded structure of conductive bodies and production method thereforMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Feb 25, 2025·0 cites·7 claims
- 1448US12030125B2Bonded body and method for manufacturing sameMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Jul 9, 2024·0 cites·9 claims
- 1548US11945974B2Composition for provisional fixation and method for producing bonded structureMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·11 claims
- 1647US2024116104A1Conductive composition for bonding, bonding structure using same, and manufacturing method thereofMITSUI MINING & SMELTING CO LTD·Filed 2021·Application pending·0 cites
- 1740US2009293766A1Conductive inkMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
- 1832US2007256857A1Conductive Paste and Flexible Printed Wiring Board Produced Using the Conductive PasteKAMIKORIYAMA YOICHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →