Inventor · disambiguated record
Keita Arakawa
Also filed as: ARAKAWA KEITA
2 granted patents·2 pending applications·1 citations·filing 2014–2024
36Inventor score
Technology areasH10P
Top patents by PatentIndex Score
4 records- 0163US10752807B2Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrateHITACHI CHEMICAL CO LTD·Filed 2014·Granted Aug 25, 2020·1 cites·37 claims
- 0261US11578236B2Slurry, polishing-liquid set, polishing liquid, and polishing method for baseHITACHI CHEMICAL CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·25 claims
- 0352US2025349551A1Polishing liquid for cmp, polishing liquid set for cmp, and polishing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 0424US2021062041A1Polishing liquid, polishing liquid set, and polishing methodHITACHI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →