Inventor · disambiguated record
Kemal Aygun
Also filed as: AYGUN KEMAL · AYGÜN KEMAL
106 granted patents·28 pending applications·401 citations·filing 2005–2024
99Inventor score
Top patents by PatentIndex Score
134 records- 0198US11621227B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2021·Granted Apr 4, 2023·6 cites·25 claims
- 0297US11901280B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 0397US11837549B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2022·Granted Dec 5, 2023·3 cites·20 claims
- 0497US11817391B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2023·Granted Nov 14, 2023·3 cites·20 claims
- 0597US8946900B2X-line routing for dense multi-chip-package interconnectsQIAN ZHIGUO·Filed 2012·Granted Feb 3, 2015·62 cites·14 claims
- 0696US12062616B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2023·Granted Aug 13, 2024·2 cites·20 claims
- 0796US9515017B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2015·Granted Dec 6, 2016·12 cites·22 claims
- 0896US8188594B2Input/output package architecturesGANESAN SANKA·Filed 2009·Granted May 29, 2012·59 cites·22 claims
- 0995US9922751B2Helically insulated twinax cable systems and methodsINTEL CORP·Filed 2016·Granted Mar 20, 2018·9 cites·10 claims
- 1093US11222848B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2017·Granted Jan 11, 2022·6 cites·25 claims
- 1193US9240377B2X-line routing for dense multi-chip-package interconnectsQIAN ZHIGUO·Filed 2014·Granted Jan 19, 2016·16 cites·10 claims
- 1293US8643184B1Crosstalk polarity reversal and cancellation through substrate material tuningZHANG ZHICHAO·Filed 2012·Granted Feb 4, 2014·19 cites·13 claims
- 1393US8025531B1Shielded socket housingINTEL CORP·Filed 2010·Granted Sep 27, 2011·29 cites·20 claims
- 1492US11715889B2Slow wave structure for millimeter wave antennasINTEL CORP·Filed 2021·Granted Aug 1, 2023·2 cites·30 claims
- 1592US10950550B2Semiconductor package with through bridge die connectionsINTEL CORP·Filed 2015·Granted Mar 16, 2021·10 cites·22 claims
- 1690US9971089B2Chip-to-chip interconnect with embedded electro-optical bridge structuresINTEL CORP·Filed 2015·Granted May 15, 2018·6 cites·19 claims
- 1790US8508947B2Flex cable and method for making the sameGANESAN SANKA·Filed 2010·Granted Aug 13, 2013·11 cites·15 claims
- 1890US7705447B2Input/output package architectures, and methods of using sameINTEL CORP·Filed 2008·Granted Apr 27, 2010·19 cites·35 claims
- 1989US9806011B2Non-uniform substrate stackupINTEL CORP·Filed 2015·Granted Oct 31, 2017·7 cites·11 claims
- 2088US9230900B1Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2014·Granted Jan 5, 2016·9 cites·25 claims
- 2187US12482733B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 2287US10692847B2Inorganic interposer for multi-chip packagingINTEL CORP·Filed 2015·Granted Jun 23, 2020·7 cites·9 claims
- 2387US8450201B2Multimode signaling on decoupled input/output and power channelsBRAUNISCH HENNING·Filed 2011·Granted May 28, 2013·7 cites·9 claims
- 2486US9542522B2Interconnect routing configurations and associated techniquesINTEL CORP·Filed 2014·Granted Jan 10, 2017·6 cites·15 claims
- 2586US7989946B2Multimode signaling on decoupled input/output and power channelsINTEL CORP·Filed 2010·Granted Aug 2, 2011·6 cites·7 claims
- 2685US10510667B2Conductive coating for a microelectronics packageINTEL CORP·Filed 2016·Granted Dec 17, 2019·4 cites·20 claims
- 2783US10056528B1Interposer structures, semiconductor assembly and methods for forming interposer structuresINTEL CORP·Filed 2017·Granted Aug 21, 2018·4 cites·23 claims
- 2883US10026682B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2016·Granted Jul 17, 2018·2 cites·20 claims
- 2981US8558636B2Package embedded equalizerSHIN JAEMIN·Filed 2007·Granted Oct 15, 2013·17 cites·21 claims
- 3080US11291133B2Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socketINTEL CORP·Filed 2018·Granted Mar 29, 2022·2 cites·25 claims
- 3179US11742275B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 3279US10416378B2Chip-to-chip interconnect with embedded electro-optical bridge structuresINTEL CORP·Filed 2018·Granted Sep 17, 2019·2 cites·9 claims
- 3378US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 3478US9069910B2Mechanism for facilitating dynamic cancellation of signal crosstalk in differential input/output channelsZHANG ZHICHAO·Filed 2012·Granted Jun 30, 2015·7 cites·18 claims
- 3577US11276635B2Horizontal pitch translation using embedded bridge diesINTEL CORP·Filed 2017·Granted Mar 15, 2022·2 cites·22 claims
- 3677US7816779B2Multimode signaling on decoupled input/output and power channelsINTEL CORP·Filed 2008·Granted Oct 19, 2010·5 cites·10 claims
- 3775US11244890B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2020·Granted Feb 8, 2022·0 cites·20 claims
- 3875US10748842B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2018·Granted Aug 18, 2020·1 cites·17 claims
- 3975US10375832B2Method of forming an interference shield on a substrateINTEL CORP·Filed 2015·Granted Aug 6, 2019·2 cites·12 claims
- 4075US10103054B2Coupled vias for channel cross-talk reductionINTEL CORP·Filed 2013·Granted Oct 16, 2018·4 cites·14 claims
- 4174US11737227B2Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socketINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·25 claims
- 4274US2025038163A1Optical multichip package with multiple system-on-chip diesINTEL CORP·Filed 2024·Application pending·0 cites
- 4373US11903138B2Fine feature formation techniques for printed circuit boardsINTEL CORP·Filed 2021·Granted Feb 13, 2024·0 cites·24 claims
- 4473US11682613B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2021·Granted Jun 20, 2023·0 cites·16 claims
- 4573US10910314B2Conductive coating for a microelectronics packageINTEL CORP·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 4673US9780510B2Socket contact techniques and configurationsINTEL CORP·Filed 2014·Granted Oct 3, 2017·3 cites·11 claims
- 4771US11095045B2Slow wave structure for millimeter wave antennasINTEL CORP·Filed 2017·Granted Aug 17, 2021·1 cites·30 claims
- 4871US9515031B2Mitigation of far-end crosstalk induced by routing and out-of-plane interconnectsALTUNYURT NEVIN·Filed 2011·Granted Dec 6, 2016·5 cites·36 claims
- 4970US11081434B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2020·Granted Aug 3, 2021·0 cites·16 claims
- 5070US9397071B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2013·Granted Jul 19, 2016·2 cites·12 claims
Showing the top 50 of 134 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →