Inventor · disambiguated record
Kewu Bai
Also filed as: BAI KEWU
1 granted patent·2 pending applications·7 citations·filing 2002–2010
30Inventor score
Top patents by PatentIndex Score
3 records- 0151US6824039B2Lead free tin based solder compositionINST OF HIGH PERFORMANCE COMPU·Filed 2002·Granted Nov 30, 2004·7 cites·37 claims
- 0233US2013037603A1Method of Forming a Bonded StructureAGENCY SCIENCE TECH & RES·Filed 2010·Application pending·0 cites
- 0326US2003183675A1Lead free tin based solder compositionHIGH PERFORMANCE COMPUTING·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →