Inventor · disambiguated record
Kenneth E. Beilstein, Jr.
Also filed as: BEILSTEIN JR KENNETH E · BEILSTEIN JR KENNETH EDWARD · BEILSTEIN KENNETH E JR
26 granted patents·1,720 citations·filing 1977–1998
98Inventor score
Files withIBM26
Top patents by PatentIndex Score
26 records- 0198US4276095AMethod of making a MOSFET device with reduced sensitivity of threshold voltage to source to substrate voltage variationsIBM·Filed 1979·Granted Jun 30, 1981·155 cites·1 claims
- 0297US4202044AQuaternary FET read only memoryIBM·Filed 1978·Granted May 6, 1980·84 cites·10 claims
- 0395US5670803AThree-dimensional SRAM trench structure and fabrication method thereforIBM·Filed 1995·Granted Sep 23, 1997·140 cites·16 claims
- 0495US5567654AMethod and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packagingIBM·Filed 1994·Granted Oct 22, 1996·150 cites·56 claims
- 0594US5466634AElectronic modules with interconnected surface metallization layers and fabrication methods thereforeIBM·Filed 1994·Granted Nov 14, 1995·153 cites·32 claims
- 0693US5786628AMethod and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packagingIBM·Filed 1997·Granted Jul 28, 1998·127 cites·11 claims
- 0792US5426566AMultichip integrated circuit packages and systemsIBM·Filed 1993·Granted Jun 20, 1995·166 cites·21 claims
- 0891US5719438AMethod and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packagingIBM·Filed 1995·Granted Feb 17, 1998·97 cites·84 claims
- 0990US5517754AFabrication processes for monolithic electronic modulesIBM·Filed 1994·Granted May 21, 1996·98 cites·42 claims
- 1088US5517057AElectronic modules with interconnected surface metallization layersIBM·Filed 1995·Granted May 14, 1996·87 cites·19 claims
- 1188US5055898ADRAM memory cell having a horizontal SOI transfer device disposed over a buried storage node and fabrication methods thereforIBM·Filed 1991·Granted Oct 8, 1991·88 cites·28 claims
- 1279US5923181AMethods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip moduleIBM·Filed 1997·Granted Jul 13, 1999·41 cites·7 claims
- 1379US5309318AThermally enhanced semiconductor chip packageIBM·Filed 1993·Granted May 3, 1994·60 cites·25 claims
- 1473US5596226ASemiconductor chip having a chip metal layer and a transfer metal and corresponding electronic moduleIBM·Filed 1994·Granted Jan 21, 1997·32 cites·2 claims
- 1572US5834818AStructure for making sub-lithographic images by the intersection of two spacersIBM·Filed 1997·Granted Nov 10, 1998·32 cites·2 claims
- 1672US5096849AProcess for positioning a mask within a concave semiconductor structureIBM·Filed 1991·Granted Mar 17, 1992·50 cites·10 claims
- 1771US5920101AStructure for making sub-lithographic images by the intersection of two spacersIBM·Filed 1998·Granted Jul 6, 1999·30 cites·10 claims
- 1871US5686843AMethods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip moduleIBM·Filed 1995·Granted Nov 11, 1997·30 cites·29 claims
- 1966US6174763B1Three-dimensional SRAM trench structure and fabrication method thereforIBM·Filed 1997·Granted Jan 16, 2001·21 cites·11 claims
- 2064US5714039AMethod for making sub-lithographic images by etching the intersection of two spacersIBM·Filed 1995·Granted Feb 3, 1998·23 cites·11 claims
- 2156US5260952AFault tolerant logic systemIBM·Filed 1991·Granted Nov 9, 1993·13 cites·20 claims
- 2248US4092548ASubstrate bias modulation to improve mosfet circuit performanceIBM·Filed 1977·Granted May 30, 1978·11 cites·16 claims
- 2347US5644162ASemiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic moduleIBM·Filed 1996·Granted Jul 1, 1997·9 cites·9 claims
- 2444US5804464ASemiconductor chip kerf clear method for forming semiconductor chips and electronic module thereforeIBM·Filed 1997·Granted Sep 8, 1998·8 cites·16 claims
- 2543US5614277AMonolithic electronic modules--fabrication and structuresIBM·Filed 1995·Granted Mar 25, 1997·9 cites·11 claims
- 2640US5670428ASemiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the sameIBM·Filed 1995·Granted Sep 23, 1997·6 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →