Inventor · disambiguated record
Kelvin Tan Aik Boo
Also filed as: BOO KELVIN TAN AIK
19 granted patents·18 pending applications·10 citations·filing 2020–2025
89Inventor score
Files withMICRON TECHNOLOGY INC37
Top patents by PatentIndex Score
37 records- 0197US11282811B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 22, 2022·5 cites·20 claims
- 0293US12237301B2Through stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 25, 2025·2 cites·20 claims
- 0388US11929351B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 12, 2024·1 cites·20 claims
- 0487US12148736B2Three-dimensional bonding scheme and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 19, 2024·1 cites·20 claims
- 0584US11527459B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 13, 2022·1 cites·9 claims
- 0680US12243807B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 0779US12293992B2Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2023·Granted May 6, 2025·0 cites·19 claims
- 0878US2025259972A1Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0977US2025349656A1Apparatus including direct-contact heat paths and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1076US11894289B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 1176US2025336796A1Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1275US2025079405A1Three-dimensional bonding scheme and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1374US2025329626A1Microelectronic device packagesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1474US2025309194A1Cross stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1570US12432859B2Surface mount device bonded to an inner layer of a multi-layer substrateMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 30, 2025·0 cites·17 claims
- 1670US12374612B2Microelectronic device packages and related methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 29, 2025·0 cites·27 claims
- 1769US11710722B2Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 1868US12431418B2Three dimensional semiconductor trace length matching and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 30, 2025·0 cites·19 claims
- 1968US12412811B2Split via structure for semiconductor device packagingMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 9, 2025·0 cites·18 claims
- 2067US12354939B2Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 8, 2025·0 cites·15 claims
- 2166US12362319B2Cross stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 2266US2025192102A1Through stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2362US12362255B2Apparatus including direct-contact heat paths and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 15, 2025·0 cites·12 claims
- 2460US11723150B2Surface mount device bonded to an inner layer of a multi-layer substrateMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 8, 2023·0 cites·7 claims
- 2560US2024404995A1Apparatus including selectable circuit placement mechanism and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2659US11562987B2Semiconductor devices with multiple substrates and die stacksMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 24, 2023·0 cites·20 claims
- 2759US2024304598A1Microelectronic devices, and related memory device packages and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2859US2024312890A1Semiconductor device assemblies with cross-stack structures, and associated methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2958US2024234390A1Stacked microelectronic package with stack mounted components and related methods, devices, and systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3058US2024234403A1Stacked microelectronic packages including interposer structures and related methods, devices, and systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3155US2023282588A1Semiconductor assemblies with systems and methods for using an interchangeable interposer to connect die to common substrateMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3253US2024072024A1Modular systems in packages, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3352US2024074048A1Semiconductor packaging with reduced standoff heightMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3452US2024071990A1Extended bond pad for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3551US2024071881A1Semiconductor packaging with reduced standoff heightMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3650US2024057265A1Stress-releasing solder mask pattern for semiconductor devices and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 3749US11688662B2Thermal distribution network for semiconductor devices and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →