Inventor · disambiguated record
Kenneth D. Brennan
Also filed as: BRENNAN KENNETH D
22 granted patents·5 pending applications·453 citations·filing 1997–2008
96Inventor score
Files withTEXAS INSTRUMENTS INC22
Top patents by PatentIndex Score
27 records- 0191US6903918B1Shielded planar capacitorTEXAS INSTRUMENTS INC·Filed 2004·Granted Jun 7, 2005·69 cites·32 claims
- 0290US7397107B2Ferromagnetic capacitorTEXAS INSTRUMENTS INC·Filed 2006·Granted Jul 8, 2008·16 cites·2 claims
- 0389US7189615B2Single mask MIM capacitor and resistor with in trench copper drift barrierTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 13, 2007·18 cites·19 claims
- 0484US7109838B2System for integrating a toroidal inductor in a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2001·Granted Sep 19, 2006·34 cites·2 claims
- 0584US6693356B2Copper transition layer for improving copper interconnection reliabilityTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 17, 2004·32 cites·11 claims
- 0682US6984580B2Dual damascene pattern linerTEXAS INSTRUMENTS INC·Filed 2004·Granted Jan 10, 2006·29 cites·21 claims
- 0778US6951812B2Copper transition layer for improving copper interconnection reliabilityTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 4, 2005·22 cites·4 claims
- 0877US7969274B2Method to improve inductance with a high-permeability slotted plate core in an integrated circuitTEXAS INSTRUMENTS INC·Filed 2008·Granted Jun 28, 2011·6 cites·12 claims
- 0976US6911389B2Self aligned vias in dual damascene interconnect, buried mask approachTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 28, 2005·24 cites·23 claims
- 1076US6600208B2Versatile system for integrated circuit containing shielded inductorTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 29, 2003·24 cites·18 claims
- 1175US6620727B2Aluminum hardmask for dielectric etchTEXAS INSTRUMENTS INC·Filed 2001·Granted Sep 16, 2003·18 cites·11 claims
- 1272US6787875B2Self-aligned vias in an integrated circuit structureTEXAS INSTRUMENTS INC·Filed 2002·Granted Sep 7, 2004·18 cites·16 claims
- 1372US5880026AMethod for air gap formation by plasma treatment of aluminum interconnectsTEXAS INSTRUMENTS INC·Filed 1997·Granted Mar 9, 1999·42 cites·7 claims
- 1470US7250334B2Metal insulator metal (MIM) capacitor fabrication with sidewall spacers and aluminum cap (ALCAP) top electrodeTEXAS INSTRUMENTS INC·Filed 2004·Granted Jul 31, 2007·17 cites·20 claims
- 1566US7118925B2Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask stepTEXAS INSTRUMENTS INC·Filed 2004·Granted Oct 10, 2006·11 cites·22 claims
- 1666US6605536B2Treatment of low-k dielectric films to enable patterning of deep submicron featuresTEXAS INSTRUMENTS INC·Filed 2002·Granted Aug 12, 2003·9 cites·7 claims
- 1763US7436281B2Method to improve inductance with a high-permeability slotted plate core in an integrated circuitTEXAS INSTRUMENTS INC·Filed 2004·Granted Oct 14, 2008·9 cites·18 claims
- 1863US6548400B2Method of fabricating interlevel connectors using only one photomask stepTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 15, 2003·11 cites·7 claims
- 1951US6074943ASidewalls for guiding the via etchTEXAS INSTRUMENTS INC·Filed 1998·Granted Jun 13, 2000·15 cites·15 claims
- 2043US6465339B2Technique for intralevel capacitive isolation of interconnect pathsTEXAS INSTRUMENTS INC·Filed 1998·Granted Oct 15, 2002·14 cites·9 claims
- 2140US6246120B1Sidewalls for guiding the via etchTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 12, 2001·8 cites·9 claims
- 2239US5998297AMethod of etching copper or copper-doped aluminumTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 7, 1999·7 cites·11 claims
- 2339US2002064951A1Treatment of low-k dielectric films to enable patterning of deep submicron featuresFiled 2001·Application pending·0 cites
- 2438US2004222527A1Dual damascene pattern linerFiled 2003·Application pending·0 cites
- 2536US2003190829A1Dual damascene barrier structures and preferential etching methodFiled 2002·Application pending·0 cites
- 2635US2002177303A1Method for sealing via sidewalls in porous low-k dielectric layersFiled 2001·Application pending·0 cites
- 2735US2003008490A1Dual hardmask process for the formation of copper/low-k interconnectsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →