Inventor · disambiguated record
Kenny Chang
Also filed as: CHANG KENNY · CHANG KENNY H
12 granted patents·3 pending applications·295 citations·filing 1995–2011
91Inventor score
Top patents by PatentIndex Score
15 records- 0194US6680544B2Flip-chip bump arrangement for decreasing impedanceVIA TECH INC·Filed 2002·Granted Jan 20, 2004·142 cites·9 claims
- 0292USD382115STool boxCHANG KENNY·Filed 1996·Granted Aug 12, 1997·53 cites·1 claims
- 0387USD367557STool boxCHANG KENNY·Filed 1995·Granted Mar 5, 1996·37 cites·1 claims
- 0479US7038309B2Chip package structure with glass substrateVIA TECH INC·Filed 2003·Granted May 2, 2006·28 cites·20 claims
- 0575US8133532B2Method of densifying porous articlesCHANG KENNY·Filed 2007·Granted Mar 13, 2012·7 cites·15 claims
- 0671US7145234B2Circuit carrier and package structure thereofVIA TECH INC·Filed 2005·Granted Dec 5, 2006·5 cites·20 claims
- 0770US7060134B2One piece shimMESSIER BUGATTI·Filed 2004·Granted Jun 13, 2006·13 cites·22 claims
- 0857US8568838B2Power control for densification of one or more porous articlesCHANG KENNY H·Filed 2007·Granted Oct 29, 2013·2 cites·10 claims
- 0948US6909187B2Conductive wiring layer structureVIA TECH INC·Filed 2002·Granted Jun 21, 2005·4 cites·8 claims
- 1047US6965169B2Hybrid integrated circuit package substrateVIA TECH INC·Filed 2003·Granted Nov 15, 2005·4 cites·3 claims
- 1146US8569188B2One piece shimCHANG KENNY·Filed 2004·Granted Oct 29, 2013·0 cites·18 claims
- 1243US8931148B2Method of making a three-dimensional fiber preform for fabricating an annular part out of carbon/carbon composite materialDELECROIX VINCENT·Filed 2011·Granted Jan 13, 2015·0 cites·6 claims
- 1337US2005035181A1Package substrate and process thereofFiled 2003·Application pending·0 cites
- 1437US2005035448A1Chip package structureFiled 2003·Application pending·0 cites
- 1536US2005012226A1Chip package structureFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →