Inventor · disambiguated record
Kevin Chen
Also filed as: CHEN KEVIN · CHEN KEVIN Y · CHEN KEVIN YU
5 granted patents·2 pending applications·207 citations·filing 1998–2024
80Inventor score
Top patents by PatentIndex Score
7 records- 0196US7170185B1Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Jan 30, 2007·122 cites·4 claims
- 0284US6246010B1High density electronic package3M INNOVATIVE PROPERTIES CO·Filed 1998·Granted Jun 12, 2001·81 cites·7 claims
- 0353US2025094608A1Techniques for providing security-related informationVANTA INC·Filed 2024·Application pending·0 cites
- 0446US12182279B2Techniques for providing security-related informationVANTA INC·Filed 2022·Granted Dec 31, 2024·0 cites·15 claims
- 0542US2007102827A1Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding3M INNOVATIVE PROPERTIES CO·Filed 2007·Application pending·0 cites
- 0639US7065662B2Information handling system featuring a power-based current limiting circuitDELL PRODUCTS LP·Filed 2003·Granted Jun 20, 2006·3 cites·22 claims
- 0739US6646862B1Dynamic circuit interfaceDELL PRODUCTS LP·Filed 2002·Granted Nov 11, 2003·1 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →