Inventor · disambiguated record
Kenneth Chun Kuen Cheng
Also filed as: CHENG KENNETH C K · CHENG KENNETH CHUN KUEN
44 granted patents·9 pending applications·40 citations·filing 2019–2022
96Inventor score
Files withIBM53
Top patents by PatentIndex Score
53 records- 0198US11024577B1Embedded anti-fuses for small scale applicationsIBM·Filed 2020·Granted Jun 1, 2021·8 cites·15 claims
- 0296US11881431B2Anti-fuse with laterally extended linerIBM·Filed 2021·Granted Jan 23, 2024·3 cites·16 claims
- 0393US11848264B2Semiconductor structure with stacked vias having dome-shaped tipsIBM·Filed 2021·Granted Dec 19, 2023·2 cites·5 claims
- 0493US11758819B2Magneto-resistive random access memory with laterally-recessed free layerIBM·Filed 2020·Granted Sep 12, 2023·2 cites·8 claims
- 0593US10748812B1Air-gap containing metal interconnectsIBM·Filed 2019·Granted Aug 18, 2020·10 cites·8 claims
- 0691US11315872B1Self-aligned top viaIBM·Filed 2020·Granted Apr 26, 2022·2 cites·14 claims
- 0789US11201056B2Pitch multiplication with high pattern fidelityIBM·Filed 2020·Granted Dec 14, 2021·2 cites·17 claims
- 0887US11244854B2Dual damascene fully aligned via in interconnectsIBM·Filed 2020·Granted Feb 8, 2022·2 cites·14 claims
- 0987US11183455B2Interconnects with enlarged contact areaIBM·Filed 2020·Granted Nov 23, 2021·2 cites·7 claims
- 1083US11430690B2Interconnects having air gap spacersIBM·Filed 2020·Granted Aug 30, 2022·1 cites·20 claims
- 1179US11205591B2Top via interconnect with self-aligned barrier layerIBM·Filed 2020·Granted Dec 21, 2021·1 cites·20 claims
- 1279US11201112B2Fully-aligned skip-viasIBM·Filed 2020·Granted Dec 14, 2021·1 cites·14 claims
- 1379US11127676B2Removal or reduction of chamfer for fully-aligned viaIBM·Filed 2020·Granted Sep 21, 2021·1 cites·20 claims
- 1479US10950493B1Interconnects having air gap spacersIBM·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 1571US11139202B2Fully aligned top vias with replacement metal linesIBM·Filed 2019·Granted Oct 5, 2021·1 cites·19 claims
- 1669US12266607B2Bottom barrier free interconnects without voidsIBM·Filed 2021·Granted Apr 1, 2025·0 cites·18 claims
- 1768US12040230B2Encapsulated top via interconnectsIBM·Filed 2021·Granted Jul 16, 2024·0 cites·12 claims
- 1867US11735475B2Removal of barrier and liner layers from a bottom of a viaIBM·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 1964US12341100B2Copper interconnects with self-aligned hourglass-shaped metal capIBM·Filed 2021·Granted Jun 24, 2025·0 cites·18 claims
- 2064US12027416B2BEOL etch stop layer without capacitance penaltyIBM·Filed 2021·Granted Jul 2, 2024·0 cites·14 claims
- 2164US11270913B2BEOL metallization formationIBM·Filed 2020·Granted Mar 8, 2022·0 cites·18 claims
- 2264US2022189826A1Beol metallization formationIBM·Filed 2022·Application pending·0 cites
- 2363US11177170B2Removal of barrier and liner layers from a bottom of a viaIBM·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 2462US12406920B2Top via interconnect with airgapIBM·Filed 2022·Granted Sep 2, 2025·0 cites·17 claims
- 2562US11164815B2Bottom barrier free interconnects without voidsIBM·Filed 2019·Granted Nov 2, 2021·0 cites·15 claims
- 2661US12057395B2Top via interconnects without barrier metal between via and above lineIBM·Filed 2021·Granted Aug 6, 2024·0 cites·11 claims
- 2760US12315807B2Reducing copper line resistanceIBM·Filed 2021·Granted May 27, 2025·0 cites·17 claims
- 2860US12087624B2Beol tip-to-tip shorting and time dependent dielectric breakdownIBM·Filed 2021·Granted Sep 10, 2024·0 cites·9 claims
- 2959US12400912B2Dual-damascene fav interconnects with dielectric plugIBM·Filed 2021·Granted Aug 26, 2025·0 cites·13 claims
- 3058US11177171B2Encapsulated top via interconnectsIBM·Filed 2019·Granted Nov 16, 2021·0 cites·9 claims
- 3157US11972977B2Fabrication of rigid close-pitch interconnectsIBM·Filed 2021·Granted Apr 30, 2024·0 cites·14 claims
- 3257US11410879B2Subtractive back-end-of-line viasIBM·Filed 2020·Granted Aug 9, 2022·0 cites·19 claims
- 3354US12438047B2Double patterning with selectively deposited spacerIBM·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 3454US12402329B2Top via containing random-access memory cross-bar arrayIBM·Filed 2021·Granted Aug 26, 2025·0 cites·17 claims
- 3554US11094580B2Structure and method to fabricate fully aligned via with reduced contact resistanceIBM·Filed 2019·Granted Aug 17, 2021·0 cites·17 claims
- 3653US12356638B2Metal-insulator-metal capacitor structure with enlarged capacitor areaIBM·Filed 2021·Granted Jul 8, 2025·0 cites·7 claims
- 3753US11380641B2Pillar bump with noble metal seed layer for advanced heterogeneous integrationIBM·Filed 2020·Granted Jul 5, 2022·0 cites·12 claims
- 3852US11177169B2Interconnects with gouged viasIBM·Filed 2019·Granted Nov 16, 2021·0 cites·12 claims
- 3952US11164774B2Interconnects with spacer structure for forming air-gapsIBM·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
- 4052US2023187341A1Barrier liner free interface for metal viaIBM·Filed 2021·Application pending·0 cites
- 4151US11289375B2Fully aligned interconnects with selective area depositionIBM·Filed 2020·Granted Mar 29, 2022·0 cites·13 claims
- 4251US2023125615A1Diffusion prevention spacerIBM·Filed 2021·Application pending·0 cites
- 4351US2023116440A1Top via structure made with bi-layer templateIBM·Filed 2021·Application pending·0 cites
- 4451US2023187343A1Top via interconnect structure with texture suppression layersIBM·Filed 2021·Application pending·0 cites
- 4551US2023120110A1Convertible interconnect barrierIBM·Filed 2021·Application pending·0 cites
- 4651US2023138988A1Dual damascene fully-aligned via interconnects with dual etch layersIBM·Filed 2021·Application pending·0 cites
- 4751US2023120199A1Copper interconnects with an embedded dielectric cap between linesIBM·Filed 2021·Application pending·0 cites
- 4850US11244897B2Back end of line metallizationIBM·Filed 2020·Granted Feb 8, 2022·0 cites·14 claims
- 4950US11177163B2Top via structure with enlarged contact area with upper metallization levelIBM·Filed 2020·Granted Nov 16, 2021·0 cites·7 claims
- 5049US11244853B2Fully aligned via interconnects with partially removed etch stop layerIBM·Filed 2020·Granted Feb 8, 2022·0 cites·10 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →