Inventor · disambiguated record
Kezia Cheng
Also filed as: CHENG KEZIA
15 granted patents·13 pending applications·22 citations·filing 2010–2024
89Inventor score
Top patents by PatentIndex Score
28 records- 0189US8878362B2Copper interconnects having a titanium—titanium nitride assembly between copper and compound semiconductorSKYWORKS SOLUTIONS INC·Filed 2013·Granted Nov 4, 2014·7 cites·25 claims
- 0286US10453763B2Packaging structures with improved adhesion and strengthSKYWORKS SOLUTIONS INC·Filed 2017·Granted Oct 22, 2019·4 cites·21 claims
- 0382US9576906B2Methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structureSKYWORKS SOLUTIONS INC·Filed 2016·Granted Feb 21, 2017·2 cites·20 claims
- 0476US9553049B2Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductorSKYWORKS SOLUTIONS INC·Filed 2013·Granted Jan 24, 2017·2 cites·19 claims
- 0576US9443803B2Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structureSKYWORKS SOLUTIONS INC·Filed 2013·Granted Sep 13, 2016·2 cites·20 claims
- 0673US8956979B2Systems and methods for improving front-side process uniformity by back-side metallizationSKYWORKS SOLUTIONS INC·Filed 2012·Granted Feb 17, 2015·2 cites·18 claims
- 0772US8373427B2Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporationSKYWORKS SOLUTIONS INC·Filed 2010·Granted Feb 12, 2013·2 cites·22 claims
- 0871US2023109569A1Bulk acoustic wave device with stacked piezoelectric layersSKYWORKS GLOBAL PTE LTD·Filed 2022·Application pending·0 cites
- 0971US2023108824A1Bulk acoustic wave device with piezoelectric layer formed by atomic layer depositionSKYWORKS GLOBAL PTE LTD·Filed 2022·Application pending·0 cites
- 1071US2023109080A1Method of manufacturing bulk acoustic wave device with atomic layer deposition of piezoelectric layerSKYWORKS GLOBAL PTE LTD·Filed 2022·Application pending·0 cites
- 1169US10026823B1Schottky contact structure for semiconductor devices and method for forming such schottky contact structureRAYTHEON CO·Filed 2017·Granted Jul 17, 2018·1 cites·14 claims
- 1264US10982322B2Methods to improve front-side process uniformity by back-side metallizationSKYWORKS SOLUTIONS INC·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 1358US2024258994A1Acoustic wave device with interdigital transducer electrode having seed layerSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 1457US10971418B2Packaging structures with improved adhesion and strengthSKYWORKS SOLUTIONS INC·Filed 2019·Granted Apr 6, 2021·0 cites·14 claims
- 1557US2015203959A1Systems, devices and methods related to source level compensation for electron-beam evaporatorsSKYWORKS SOLUTIONS INC·Filed 2014·Application pending·0 cites
- 1657US2017186694A1Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structureSKYWORKS SOLUTIONS INC·Filed 2017·Application pending·0 cites
- 1755US2024112904A1Plasma process uniformity by wafer back side dopingSKYWORKS GLOBAL PTE LTD·Filed 2023·Application pending·0 cites
- 1854US9068918B2Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporationSKYWORKS SOLUTIONS INC·Filed 2012·Granted Jun 30, 2015·0 cites·20 claims
- 1953US9768081B2Electron radiation monitoring electrode system to prevent gold spitting and resist cross-linking during evaporationSKYWORKS SOLUTIONS INC·Filed 2015·Granted Sep 19, 2017·0 cites·20 claims
- 2052US10439035B2Schottky contact structure for semiconductor devices and method for forming such Schottky contact structureRAYTHEON CO·Filed 2018·Granted Oct 8, 2019·0 cites·5 claims
- 2151US10541148B2Method for controlling the amount of radiation having a predetermined wavelength to be absorbed by a structure disposed on a semiconductorRAYTHEON CO·Filed 2018·Granted Jan 21, 2020·0 cites·12 claims
- 2251US2023113584A1Method for forming a piezoelectric filmSKYWORKS GLOBAL PTE LTD·Filed 2022·Application pending·0 cites
- 2351US2023048476A1Surface acoustic wave device comprising multi-layer interdigital transducer electrodeSKYWORKS SOLUTIONS INC·Filed 2022·Application pending·0 cites
- 2448US2015129130A1Systems to improve front-side process uniformity by back-side metallizationSKYWORKS SOLUTIONS INC·Filed 2015·Application pending·0 cites
- 2546US10840114B1Rapid thermal anneal apparatus and methodRAYTHEON CO·Filed 2017·Granted Nov 17, 2020·0 cites·17 claims
- 2637US2017243739A13d micromold and pattern transferSKYWORKS SOLUTIONS INC·Filed 2017·Application pending·0 cites
- 2737US2017365554A1Polymer bonding with improved step coverageSKYWORKS SOLUTIONS INC·Filed 2017·Application pending·0 cites
- 2835US2017345676A1Wafer level packaging using a transferable structureSKYWORKS SOLUTIONS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →