Inventor · disambiguated record
Kenneth Cholewczynski
Also filed as: CHOLEWCZYNSKI KENNETH
3 granted patents·559 citations·filing 1990–1992
80Inventor score
Files withMOTOROLA INC3
Top patents by PatentIndex Score
3 records- 0195US5186383AMethod for forming solder bump interconnections to a solder-plated circuit traceMOTOROLA INC·Filed 1991·Granted Feb 16, 1993·152 cites·10 claims
- 0293US5269453ALow temperature method for forming solder bump interconnections to a plated circuit traceMOTOROLA INC·Filed 1992·Granted Dec 14, 1993·180 cites·14 claims
- 0393US5120678AElectrical component package comprising polymer-reinforced solder bump interconnectionMOTOROLA INC·Filed 1990·Granted Jun 9, 1992·227 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →