Inventor · disambiguated record
Keen Wah Chow
Also filed as: CHOW KEEN WAH
6 granted patents·4 pending applications·15 citations·filing 2006–2024
77Inventor score
Files withMICRON TECHNOLOGY INC6TECH SEMICONDUCTOR SINGAPORE2KUMAR ARVIND1LODESTAR LICENSING GROUP LLC1
Top patents by PatentIndex Score
10 records- 0186US11101171B2Apparatus comprising structures including contact vias and conductive lines, related methods, and memory devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 24, 2021·4 cites·28 claims
- 0284US9773807B1Conductive components and memory assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 26, 2017·4 cites·26 claims
- 0376US2024266214A1Apparatuses and memory devices including conductive lines and interconnect structuresLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 0475US7407871B2Method for passivation of plasma etch defects in DRAM devicesTECH SEMICONDUCTOR SINGAPORE·Filed 2006·Granted Aug 5, 2008·6 cites·18 claims
- 0570US11990367B2Apparatus and memory device including conductive lines and contacts, and methods of forming an apparatus including conductive lines and contactsMICRON TECHNOLOGY INC·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 0668US10014319B1Conductive components and memory assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Jul 3, 2018·1 cites·23 claims
- 0755US10475810B2Conductive components and memory assembliesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 12, 2019·0 cites·27 claims
- 0841US2021091009A1Integrated Assemblies Having Barrier Material Between Silicon-Containing Material and Another Material Reactive with SiliconMICRON TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 0935US2013234280A1Shallow trench isolation in dynamic random access memory and manufacturing method thereofKUMAR ARVIND·Filed 2012·Application pending·0 cites
- 1031US2011201185A1Method to improve transistor performance matching for plasma-assisted source/drain formationTECH SEMICONDUCTOR SINGAPORE·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →