Inventor · disambiguated record
Kenneth M. Cole, Sr.
Also filed as: COLE KENNETH M · COLE KENNETH M SR · COLE KENNETH MARK · COLE SR KENNETH M
13 granted patents·2 pending applications·407 citations·filing 1997–2017
93Inventor score
Top patents by PatentIndex Score
15 records- 0192US6415858B1Temperature control system for a workpiece chuckTEMPTRONIC CORP·Filed 1997·Granted Jul 9, 2002·127 cites·43 claims
- 0291US6540014B2Workpiece chuckTEMPTRONIC CORP·Filed 2000·Granted Apr 1, 2003·55 cites·20 claims
- 0390US6700099B2Wafer chuck having thermal plate with interleaved heating and cooling elements, interchangeable top surface assemblies and hard coated layer surfacesTEMPTRONIC CORP·Filed 2001·Granted Mar 2, 2004·43 cites·23 claims
- 0484US6073681AWorkpiece chuckTEMPTRONIC CORP·Filed 1997·Granted Jun 13, 2000·64 cites·38 claims
- 0583US7629533B2Temperature-controlled enclosures and temperature control system using the sameTEMPTRONIC CORP·Filed 2007·Granted Dec 8, 2009·12 cites·4 claims
- 0680US6802368B2Temperature control system for a workpiece chuckTEMPTRONIC CORP·Filed 2002·Granted Oct 12, 2004·20 cites·18 claims
- 0775US6019164AWorkpiece chuckTEMPTRONIC CORP·Filed 1998·Granted Feb 1, 2000·44 cites·42 claims
- 0871US6375176B1Workpiece chuck with guard layer having vacuum distribution patternTEMPTRONIC CORP·Filed 1999·Granted Apr 23, 2002·35 cites·8 claims
- 0969US8408020B2Temperature-controlled enclosures and temperature control system using the sameCOLE SR KENNETH M·Filed 2009·Granted Apr 2, 2013·6 cites·51 claims
- 1054US10060668B2Temperature-controlled enclosures and temperature control system using the sameTEMPTRONIC CORP·Filed 2013·Granted Aug 28, 2018·0 cites·55 claims
- 1151US9767932B2Systems and methods of remote control rod drive decouplingGE HITACHI NUCLEAR ENERGY AMERICAS LLC·Filed 2014·Granted Sep 19, 2017·0 cites·19 claims
- 1250US11107596B2Flange flush toolGE HITACHI NUCLEAR ENERGY AMERICAS LLC·Filed 2017·Granted Aug 31, 2021·0 cites·12 claims
- 1349US2005217583A1Wafer chuck having thermal plate with interleaved heating and cooling elementsTEMPTRONIC CORP·Filed 2005·Application pending·0 cites
- 1447US6969830B2Wafer chuck having thermal plate with interleaved heating and cooling elementsTEMPTRONIC CORP·Filed 2003·Granted Nov 29, 2005·1 cites·20 claims
- 1535US2005121186A1Apparatus and method for reducing electrical noise in a thermally controlled chuckTEMPTRONIC CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →