Inventor · disambiguated record
Kevin Cote
Also filed as: COTE KEVIN · COTE KEVIN J
8 granted patents·2 pending applications·197 citations·filing 2000–2012
89Inventor score
Top patents by PatentIndex Score
10 records- 0187US6867493B2Structure and method for fabrication of a leadless multi-die carrierSKYWORKS SOLUTIONS INC·Filed 2001·Granted Mar 15, 2005·50 cites·23 claims
- 0284US6960031B2Apparatus and method of packaging two dimensional photonic array devicesPRIMARION INC·Filed 2002·Granted Nov 1, 2005·35 cites·25 claims
- 0382US6960824B1Structure and method for fabrication of a leadless chip carrierSKYWORKS SOLUTIONS INC·Filed 2001·Granted Nov 1, 2005·33 cites·19 claims
- 0481US7002249B2Microelectronic component with reduced parasitic inductance and method of fabricatingPRIMARION INC·Filed 2002·Granted Feb 21, 2006·32 cites·14 claims
- 0580US6803665B1Off-chip inductorSKYWORKS SOLUTIONS INC·Filed 2001·Granted Oct 12, 2004·32 cites·15 claims
- 0675US7247516B1Method for fabricating a leadless chip carrierSKYWORKS SOLUTIONS INC·Filed 2005·Granted Jul 24, 2007·6 cites·16 claims
- 0750US6850658B2Apparatus for coupling an optoelectronic device to a fiber optic cable and a microelectronic device, a system including the apparatus, and a method of forming the samePRIMARION INC·Filed 2002·Granted Feb 1, 2005·2 cites·52 claims
- 0848US6903270B1Method and structure for securing a mold compound to a printed circuit boardSKYWORKS SOLUTIONS INC·Filed 2000·Granted Jun 7, 2005·7 cites·16 claims
- 0946US2014067472A1System and Method For Segmenting A Customer BaseMAYES DANIEL·Filed 2012·Application pending·0 cites
- 1024US2002096767A1Cavity down ball grid array package with EMI shielding and reduced thermal resistanceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →