Inventor · disambiguated record
Kerrin Doessel
Also filed as: DOESSEL KERRIN
11 granted patents·2 pending applications·1 citations·filing 2014–2021
78Inventor score
Top patents by PatentIndex Score
13 records- 0170US10547951B2Micromechanical sound transducer system and corresponding manufacturing methodBOSCH GMBH ROBERT·Filed 2018·Granted Jan 28, 2020·1 cites·16 claims
- 0258US12481150B2Micromechanical deviceBOSCH GMBH ROBERT·Filed 2021·Granted Nov 25, 2025·0 cites·16 claims
- 0352US11840445B2MEMS sensor including a diaphragm and method for manufacturing a MEMS sensorBOSCH GMBH ROBERT·Filed 2019·Granted Dec 12, 2023·0 cites·12 claims
- 0448US11912565B2Micromechanical sensor unit and method for manufacturing a micromechanical sensor unitBOSCH GMBH ROBERT·Filed 2019·Granted Feb 27, 2024·0 cites·10 claims
- 0548US9885866B2Mirror system and projection deviceBOSCH GMBH ROBERT·Filed 2015·Granted Feb 6, 2018·0 cites·16 claims
- 0645US11733068B2Readout signal generator and method for operating a capacitive deviceBOSCH GMBH ROBERT·Filed 2020·Granted Aug 22, 2023·0 cites·9 claims
- 0745US10389394B2Method and device for processing a signalBOSCH GMBH ROBERT·Filed 2018·Granted Aug 20, 2019·0 cites·15 claims
- 0845US9360664B2Micromechanical component and method for producing a micromechanical componentARMBRUSTER SIMON·Filed 2014·Granted Jun 7, 2016·0 cites·11 claims
- 0940US10012828B2Assembly body for micromirror chips, mirror device and production method for a mirror deviceBOSCH GMBH ROBERT·Filed 2015·Granted Jul 3, 2018·0 cites·10 claims
- 1039US11940618B2Micromechanical component and method for producing a micromechanical componentBOSCH GMBH ROBERT·Filed 2019·Granted Mar 26, 2024·0 cites·13 claims
- 1137US2017352795A1Sensor and/or transducer device and method for operating a sensor and/or transducer device having at least one bending structure, which includes at least one piezoelectric layerBOSCH GMBH ROBERT·Filed 2017·Application pending·0 cites
- 1235US10868231B2Micromechanical component and production method for a micromechanical componentBOSCH GMBH ROBERT·Filed 2017·Granted Dec 15, 2020·0 cites·7 claims
- 1334US2017332176A1Micromechanical component and method for packaging a substrate having a micro-electromechanical microphone structure which includes at least one piezoelectric layerBOSCH GMBH ROBERT·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →