Inventor · disambiguated record
Keiichi Endoh
Also filed as: ENDOH KEIICHI
14 granted patents·6 pending applications·16 citations·filing 2009–2020
86Inventor score
Top patents by PatentIndex Score
20 records- 0182US8641929B2Low-temperature-sinterable bonding material, and bonding method using the bonding materialENDOH KEIICHI·Filed 2011·Granted Feb 4, 2014·9 cites·8 claims
- 0273US10328534B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted Jun 25, 2019·2 cites·15 claims
- 0369US9662748B2Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding methodDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted May 30, 2017·1 cites·8 claims
- 0466US9533380B2Bonding material and bonding method in which said bonding material is usedENDOH KEIICHI·Filed 2012·Granted Jan 3, 2017·2 cites·8 claims
- 0563US2018331063A1Method for joining electronic part using a joining silver sheetDOWA ELECTRONICS MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 0661US2016254243A1Joining silver sheet, method for manufacturing same, and method for joining electronic partDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Application pending·0 cites
- 0760US9240256B2Bonding material and bonding method using the sameENDOH KEIICHI·Filed 2010·Granted Jan 19, 2016·1 cites·4 claims
- 0855US10543569B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jan 28, 2020·0 cites·20 claims
- 0955US8858700B2Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding methodENDOH KEIICHI·Filed 2009·Granted Oct 14, 2014·1 cites·7 claims
- 1050US10008471B2Bonding material and bonding method using the sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·2 claims
- 1149US10090275B2Bonding method using bonding materialDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Oct 2, 2018·0 cites·8 claims
- 1248US12048964B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Jul 30, 2024·0 cites·17 claims
- 1346US2023311249A1Metal paste for bonding and bonding methodDOWA ELECTRONICS MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 1445US2020094318A1Bonding material and bonding method employing sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Application pending·0 cites
- 1544US11453053B2Joining material and joining method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Sep 27, 2022·0 cites·20 claims
- 1641US2016121435A1Metal paste for joining, joining method and joined bodyFURUKAWA MASASHI·Filed 2014·Application pending·0 cites
- 1740US10821558B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Nov 3, 2020·0 cites·7 claims
- 1837US2020035637A1Bonding material and bonded product using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 1933US10903185B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jan 26, 2021·0 cites·13 claims
- 2033US9486879B2Bonding material and bonding body, and bonding methodKURITA SATORU·Filed 2011·Granted Nov 8, 2016·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →