Inventor · disambiguated record
Kehong Fang
Also filed as: FANG KEHONG
8 granted patents·5 pending applications·9 citations·filing 2011–2018
76Inventor score
Top patents by PatentIndex Score
13 records- 0187US10144824B2Halogen free resin composition and prepreg and laminated board prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Dec 4, 2018·5 cites·19 claims
- 0281US10343383B2Thermosetting resin composition and prepreg and laminated board prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Jul 9, 2019·2 cites·16 claims
- 0367US8889816B2Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weightMENG YUNDONG·Filed 2011·Granted Nov 18, 2014·2 cites·9 claims
- 0456US11970591B2Resin composition, prepreg for printed circuit and metal-coated laminateSHENGYI TECHNOLOGY CO LTD·Filed 2018·Granted Apr 30, 2024·0 cites·19 claims
- 0555US10336875B2Halogen-free resin composition and prepreg and laminate prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Jul 2, 2019·0 cites·19 claims
- 0653US10513605B2Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Dec 24, 2019·0 cites·11 claims
- 0749US2018304604A1Thermoset resin composition, and prepreg and laminated board made of sameSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 0847US10400099B2Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Sep 3, 2019·0 cites·15 claims
- 0942US2018201776A1Epoxy resin composition for copper clad laminate, and application of epoxy resin compositionSHENGYI TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 1042US2018201761A1Epoxy resin composition for copper clad laminate, and application of epoxy resin compositionSHENGYI TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 1139US2019300649A1Flame-retardant polyphenylene ether resin compositionSHENGYI TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
- 1238US2018223093A1Epoxy resin composition for copper clad laminate, and application of epoxy resin compositionSHENGYI TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 1333US9670362B2Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefromMENG YUNDONG·Filed 2011·Granted Jun 6, 2017·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →