Inventor · disambiguated record
Kesheng Feng
Also filed as: FENG KESHENG
13 granted patents·2 pending applications·62 citations·filing 1997–2012
88Inventor score
Top patents by PatentIndex Score
15 records- 0174US7456114B2Microetching composition and method of using the sameFENG KESHENG·Filed 2005·Granted Nov 25, 2008·5 cites·32 claims
- 0273US8486281B2Nickel-chromium alloy stripper for flexible wiring boardsFENG KESHENG·Filed 2009·Granted Jul 16, 2013·5 cites·15 claims
- 0372US8308893B2Nano-oxide process for bonding copper/copper alloy and resinWANG MING DE·Filed 2010·Granted Nov 13, 2012·1 cites·28 claims
- 0471US6610760B2Radiation curable silicone compositionGEN ELECTRIC·Filed 2001·Granted Aug 26, 2003·9 cites·20 claims
- 0570US8263177B2Organic polymer coating for protection against creep corrosionFENG KESHENG·Filed 2009·Granted Sep 11, 2012·1 cites·13 claims
- 0666US5955002AMethod for determining properties of a polymer coating or film cured by cationic polymerizationSPECTRA GROUP LTD INC·Filed 1997·Granted Sep 21, 1999·36 cites·11 claims
- 0763US7645393B2Metal surface treatment compositionFENG KESHENG·Filed 2007·Granted Jan 12, 2010·2 cites·47 claims
- 0859US8518281B2Acid-resistance promoting compositionFENG KESHENG·Filed 2008·Granted Aug 27, 2013·1 cites·9 claims
- 0959US8088246B2Process for improving the adhesion of polymeric materials to metal surfacesCORDANI JR JOHN L·Filed 2009·Granted Jan 3, 2012·1 cites·21 claims
- 1055US7393461B2Microetching solutionFENG KESHENG·Filed 2005·Granted Jul 1, 2008·1 cites·17 claims
- 1150US7875558B2Microetching composition and method of using the sameFENG KESHENG·Filed 2007·Granted Jan 25, 2011·0 cites·32 claims
- 1246US8512504B2Process for improving adhesion of polymeric materials to metal surfacesCASTALDI STEVEN A·Filed 2009·Granted Aug 20, 2013·0 cites·14 claims
- 1344US7094523B1Developer solution and process for useFENG KESHENG·Filed 2005·Granted Aug 22, 2006·0 cites·12 claims
- 1440US2013045391A1Tarnish Inhibiting Composition for Metal LeadframesFENG KESHENG·Filed 2011·Application pending·0 cites
- 1537US2013186764A1Low Etch Process for Direct MetallizationFENG KESHENG·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kesheng Feng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →