Inventor · disambiguated record
Kenzo Fujii
Also filed as: FUJII KENZO
6 granted patents·1 pending application·199 citations·filing 1980–2001
86Inventor score
Top patents by PatentIndex Score
7 records- 0193US6564448B1Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing itNEC CORP·Filed 2000·Granted May 20, 2003·97 cites·5 claims
- 0283US6286207B1Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing itNEC CORP·Filed 1999·Granted Sep 11, 2001·63 cites·23 claims
- 0373US6492597B2Wiring substrate, multi-layered wiring substrate and method of fabricating thoseNEC CORP·Filed 2000·Granted Dec 10, 2002·18 cites·41 claims
- 0467US6523256B1Method of manufacturing a wiring boardNEC CORP·Filed 2000·Granted Feb 25, 2003·11 cites·8 claims
- 0561US6449835B1Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing itNEC CORP·Filed 2000·Granted Sep 17, 2002·8 cites·4 claims
- 0641US4302600AProcess for the purification of an aqueous acrylamide solutionMITSUI TOATSU CHEMICALS·Filed 1980·Granted Nov 24, 1981·2 cites·4 claims
- 0733US2003006489A1Flexible wiring substrate interposed between semiconductor element and circuit substrateFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →