Inventor · disambiguated record
Kenshiro Fukuda
Also filed as: FUKUDA KENSHIRO
3 granted patents·1 pending application·0 citations·filing 2018–2023
39Inventor score
Files withMITSUI MINING & SMELTING CO LTD4
Top patents by PatentIndex Score
4 records- 0156US12351698B2Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Jul 8, 2025·0 cites·17 claims
- 0250US2025227856A1Method for producing printed wiring board with built-in capacitor and multilayer printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2023·Application pending·0 cites
- 0348US11310910B2Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·10 claims
- 0445US12297354B2Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted May 13, 2025·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →