Inventor · disambiguated record
Kei Fukui
Also filed as: FUKUI KEI
7 granted patents·1 pending application·14 citations·filing 2011–2018
76Inventor score
Top patents by PatentIndex Score
8 records- 0180US8800142B2Package substrate unit and method for manufacturing package substrate unitNANG HNIN NWAY SAN·Filed 2011·Granted Aug 12, 2014·10 cites·2 claims
- 0273US10109571B2Wiring substrate and manufacturing method of wiring substrateFUJITSU LTD·Filed 2016·Granted Oct 23, 2018·2 cites·10 claims
- 0361US8959758B2Method of manufacturing circuit board, method of manufacturing electronic device, and electronic deviceARAI KAZUYA·Filed 2012·Granted Feb 24, 2015·2 cites·9 claims
- 0450US9192058B2Method for manufacturing component built-in substrateFUJITSU LTD·Filed 2014·Granted Nov 17, 2015·0 cites·12 claims
- 0547US9386700B2Method of manufacturing circuit board, method of manufacturing electronic device, and electronic deviceFUJITSU LTD·Filed 2015·Granted Jul 5, 2016·0 cites·6 claims
- 0644US11317520B2Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2018·Granted Apr 26, 2022·0 cites·8 claims
- 0737US10396020B2Method of manufacturing boardFUJITSU LTD·Filed 2018·Granted Aug 27, 2019·0 cites·6 claims
- 0835US2017020000A1Component-mounted board, method of manufacturing component-mounted board and component-embedded boardFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →