Inventor · disambiguated record
Kevin Haberern
Also filed as: HABERERN KEVIN · HABERERN KEVIN W · HABERERN KEVIN WARD
70 granted patents·16 pending applications·1,165 citations·filing 1993–2025
99Inventor score
Top patents by PatentIndex Score
86 records- 0199US7795623B2Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structuresCREE INC·Filed 2007·Granted Sep 14, 2010·92 cites·47 claims
- 0298US7737459B2High output group III nitride light emitting diodesCREE INC·Filed 2005·Granted Jun 15, 2010·65 cites·31 claims
- 0398US6582986B2Single step pendeo-and lateral epitaxial overgrowth of group III-nitride epitaxial layers with group III-nitride buffer layer and resulting structuresCREE INC·Filed 2001·Granted Jun 24, 2003·164 cites·15 claims
- 0497US6955977B2Single step pendeo-and lateral epitaxial overgrowth of group III-nitride epitaxial layers with group III-nitride buffer layer and resulting structuresCREE INC·Filed 2003·Granted Oct 18, 2005·84 cites·40 claims
- 0597US6812053B1Single step pendeo- and lateral epitaxial overgrowth of Group III-nitride epitaxial layers with Group III-nitride buffer layer and resulting structuresCREE INC·Filed 2000·Granted Nov 2, 2004·104 cites·29 claims
- 0696US10312224B2High density pixelated LED and devices and methods thereofCREE INC·Filed 2017·Granted Jun 4, 2019·11 cites·28 claims
- 0796US9666764B2Wafer level packaging of multiple light emitting diodes (LEDs) on a single carrier dieCREE INC·Filed 2013·Granted May 30, 2017·47 cites·16 claims
- 0895US8686429B2LED structure with enhanced mirror reflectivityBERGMANN MICHAEL·Filed 2011·Granted Apr 1, 2014·25 cites·30 claims
- 0993US9728676B2High voltage monolithic LED chipCREE INC·Filed 2013·Granted Aug 8, 2017·13 cites·33 claims
- 1093USD566057SLED chipCREE INC·Filed 2006·Granted Apr 8, 2008·54 cites·1 claims
- 1192US10529696B2High density pixelated LED and devices and methods thereofCREE INC·Filed 2017·Granted Jan 7, 2020·6 cites·26 claims
- 1290US11588083B2High voltage monolithic LED chip with improved reliabilityCREELED INC·Filed 2020·Granted Feb 21, 2023·2 cites·29 claims
- 1390USD593968SLED chipCREE INC·Filed 2008·Granted Jun 9, 2009·36 cites·1 claims
- 1490USD582866SLED chipCREE INC·Filed 2007·Granted Dec 16, 2008·37 cites·1 claims
- 1589US8163577B2Methods of forming light emitting devices having current reducing structuresEMERSON DAVID TODD·Filed 2010·Granted Apr 24, 2012·8 cites·14 claims
- 1689USD566056SLED chipCREE INC·Filed 2006·Granted Apr 8, 2008·41 cites·1 claims
- 1788US10910352B2High density pixelated LED and devices and methods thereofCREE INC·Filed 2019·Granted Feb 2, 2021·3 cites·22 claims
- 1886US11387389B2Reflective layers for light-emitting diodesCREELED INC·Filed 2019·Granted Jul 12, 2022·2 cites·25 claims
- 1985US11387221B2High density pixelated LED and devices and methods thereofCREE INC·Filed 2020·Granted Jul 12, 2022·1 cites·21 claims
- 2085US10115860B2High voltage monolithic LED chipCREE INC·Filed 2017·Granted Oct 30, 2018·3 cites·25 claims
- 2184US6764932B2Single step pendeo- and lateral epitaxial overgrowth of group III-nitride epitaxial layers with group III-nitride buffer layer and resulting structuresCREE INC·Filed 2002·Granted Jul 20, 2004·20 cites·16 claims
- 2283US11916165B2High voltage monolithic LED chipCREELED INC·Filed 2020·Granted Feb 27, 2024·1 cites·13 claims
- 2383US10243121B2High voltage monolithic LED chip with improved reliabilityCREE INC·Filed 2015·Granted Mar 26, 2019·3 cites·37 claims
- 2483US9443903B2Low temperature high strength metal stack for die attachmentBERGMANN MICHAEL JOHN·Filed 2012·Granted Sep 13, 2016·7 cites·34 claims
- 2583US7160747B2Methods of forming semiconductor devices having self aligned semiconductor mesas and contact layersCREE INC·Filed 2003·Granted Jan 9, 2007·14 cites·61 claims
- 2682US10957830B2High voltage monolithic LED chip with improved reliabilityCREE INC·Filed 2019·Granted Mar 23, 2021·2 cites·20 claims
- 2780US11843083B2High voltage monolithic LED chip with improved reliabilityCREELED INC·Filed 2023·Granted Dec 12, 2023·0 cites·16 claims
- 2880US7613219B2Semiconductor devices having self aligned semiconductor mesas and contact layersCREE INC·Filed 2006·Granted Nov 3, 2009·4 cites·29 claims
- 2980US5882988ASemiconductor chip-making without scribingPHILIPS ELECTRONICS NA·Filed 1997·Granted Mar 16, 1999·64 cites·6 claims
- 3079US5561680AII-VI semiconductor diode laser having a strained layerPHILIPS ELECTRONICS NA·Filed 1994·Granted Oct 1, 1996·36 cites·17 claims
- 3179US2024194832A1Reflective layers for light-emitting diodesCREELED INC·Filed 2024·Application pending·0 cites
- 3278US11776938B2High density pixelated LED and devices and methods thereofCREELED INC·Filed 2022·Granted Oct 3, 2023·0 cites·16 claims
- 3378USD602450SLED chipCREE INC·Filed 2008·Granted Oct 20, 2009·19 cites·1 claims
- 3477US8772757B2Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devicesEMERSON DAVID TODD·Filed 2008·Granted Jul 8, 2014·5 cites·42 claims
- 3576US11923481B2Reflective layers for light-emitting diodesCREELED INC·Filed 2022·Granted Mar 5, 2024·0 cites·13 claims
- 3675US10797201B2High voltage monolithic LED chipCREE INC·Filed 2018·Granted Oct 6, 2020·1 cites·19 claims
- 3775US8896122B2Semiconductor devices having gates including oxidized nickelMIECZKOWSKI VAN·Filed 2010·Granted Nov 25, 2014·4 cites·14 claims
- 3875US7557380B2Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond padsCREE INC·Filed 2004·Granted Jul 7, 2009·15 cites·11 claims
- 3975US6803602B2Single step pendeo- and lateral epitaxial overgrowth of Group III-nitride epitaxial layers with Group III-nitride buffer layer and resulting structuresCREE INC·Filed 2003·Granted Oct 12, 2004·11 cites·22 claims
- 4075US5363395ABlue-green injection laser structure utilizing II-VI compoundsPHILIPS CORP·Filed 1993·Granted Nov 8, 1994·33 cites·19 claims
- 4173USD682225SLight emitting diodeBERGMANN MICHAEL·Filed 2011·Granted May 14, 2013·22 cites·1 claims
- 4269US2025226363A1Led chips and devices with textured light-extracting portions, and fabrication methodsCREELED INC·Filed 2025·Application pending·0 cites
- 4367US7557379B2Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond padsCREE INC·Filed 2008·Granted Jul 7, 2009·2 cites·19 claims
- 4464US12278219B2LED chips and devices with textured light-extracting portions, and fabrication methodsCREELED INC·Filed 2021·Granted Apr 15, 2025·0 cites·22 claims
- 4564US2021367112A1Wafer level packaging of multiple light emitting diodes (leds) on a single carrier dieCREELED INC·Filed 2021·Application pending·0 cites
- 4663US9496458B2Semiconductor light emitting diodes with crack-tolerant barrier structures and methods of fabricating the sameCREE INC·Filed 2013·Granted Nov 15, 2016·1 cites·25 claims
- 4762US9437785B2Light emitting diodes including integrated backside reflector and die attachBERGMANN MICHAEL JOHN·Filed 2009·Granted Sep 6, 2016·2 cites·23 claims
- 4862USD583338SLED chipCREE INC·Filed 2007·Granted Dec 23, 2008·10 cites·1 claims
- 4962US7329569B2Methods of forming semiconductor devices including mesa structures and multiple passivation layersCREE INC·Filed 2003·Granted Feb 12, 2008·4 cites·70 claims
- 5061US2025331338A1Multi-layer reflective structures for light-emitting diode chips and related methodsCREELED INC·Filed 2024·Application pending·0 cites
Showing the top 50 of 86 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Kevin Haberern files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →