Inventor · disambiguated record
Ken Hackenberg
Also filed as: HACKENBERG KEN · HACKENBERG KEN P
10 granted patents·3 pending applications·7 citations·filing 2016–2019
80Inventor score
Top patents by PatentIndex Score
13 records- 0172US12272614B2Integrated circuit packages with solder thermal interface materials with embedded particlesINTEL CORP·Filed 2019·Granted Apr 8, 2025·2 cites·20 claims
- 0270US12062592B2Integrated circuit packages with thermal interface materials with different material compositionsINTEL CORP·Filed 2019·Granted Aug 13, 2024·2 cites·30 claims
- 0369US11404349B2Multi-chip packages and sinterable paste for use with thermal interface materialsINTEL CORP·Filed 2016·Granted Aug 2, 2022·2 cites·11 claims
- 0464US10224299B2Sintered solder for fine pitch first-level interconnect (FLI) applicationsINTEL CORP·Filed 2016·Granted Mar 5, 2019·1 cites·14 claims
- 0554US10515914B2Sintered solder for fine pitch first-level interconnect (FLI) applicationsINTEL CORP·Filed 2019·Granted Dec 24, 2019·0 cites·19 claims
- 0651US11832419B2Full package vapor chamber with IHSINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 0751US11798861B2Integrated heat spreader (IHS) with heating elementINTEL CORP·Filed 2019·Granted Oct 24, 2023·0 cites·20 claims
- 0848US11710672B2Microelectronic package with underfilled sealantINTEL CORP·Filed 2019·Granted Jul 25, 2023·0 cites·20 claims
- 0948US2019099776A1Compressible media applicator, application system and methods for sameHACKENBERG KEN P·Filed 2017·Application pending·0 cites
- 1046US11791237B2Microelectronic assemblies including a thermal interface materialINTEL CORP·Filed 2018·Granted Oct 17, 2023·0 cites·13 claims
- 1146US11710677B2Ultraviolet (UV)-curable sealant in a microelectronic packageINTEL CORP·Filed 2019·Granted Jul 25, 2023·0 cites·19 claims
- 1237US2019099777A1Compressible media applicator, application system and methods for sameINTEL CORP·Filed 2017·Application pending·0 cites
- 1336US2019206753A1Bicontinuous porous ceramic composite for semiconductor package applicationsINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →