Inventor · disambiguated record
Kenji Hagiwara
Also filed as: HAGIWARA KENJI
25 granted patents·16 pending applications·296 citations·filing 1992–2025
96Inventor score
Top patents by PatentIndex Score
41 records- 0194US8193269B2Silicone resin composition for optical semiconductor devices and an optical semiconductor deviceTAGUCHI YUSUKE·Filed 2010·Granted Jun 5, 2012·15 cites·3 claims
- 0289US6823954B2Control system for hybrid vehicleHONDA MOTOR CO LTD·Filed 2002·Granted Nov 30, 2004·62 cites·22 claims
- 0386US9276958B2Customizing security role in device management system, apparatus and methodHAGIWARA KENJI·Filed 2013·Granted Mar 1, 2016·13 cites·18 claims
- 0485US9007631B2System, apparatus and method for managing heterogeneous group of devicesHAGIWARA KENJI·Filed 2013·Granted Apr 14, 2015·11 cites·20 claims
- 0584US8675214B2Device management device and recording mediumHAGIWARA KENJI·Filed 2011·Granted Mar 18, 2014·5 cites·9 claims
- 0683US6275760B1Control system for automatic vehicle transmissionsHONDA MOTOR CO LTD·Filed 1999·Granted Aug 14, 2001·37 cites·18 claims
- 0782US9130838B2Device management system, apparatus and method configured for customizing a power filterANDERSON GREG·Filed 2013·Granted Sep 8, 2015·12 cites·20 claims
- 0882US6516261B2Control system for automatic vehicle transmissionsHONDA MOTOR CO LTD·Filed 1999·Granted Feb 4, 2003·36 cites·13 claims
- 0981US7257522B2Simulator for automatic vehicle transmission controllersHONDA MOTOR CO LTD·Filed 2001·Granted Aug 14, 2007·28 cites·34 claims
- 1079US8022137B2Silicone resin composition for optical semiconductor devicesSHINETSU CHEMICAL CO·Filed 2009·Granted Sep 20, 2011·9 cites·4 claims
- 1178US12305036B2Epoxy resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Granted May 20, 2025·1 cites·15 claims
- 1273US9442911B2Adding annotations to a mapHAGIWARA KENJI·Filed 2014·Granted Sep 13, 2016·3 cites·18 claims
- 1369US8024654B2Providing device usage information through layout diagramRICOH CO LTD·Filed 2007·Granted Sep 20, 2011·5 cites·17 claims
- 1468US2024263004A1Resin composition for encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1567US2025382494A1Motor-sealing resin compositionSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 1665US9325784B2Device management device and recording mediumRICOH CO LTD·Filed 2015·Granted Apr 26, 2016·1 cites·8 claims
- 1765US5270596AMiniature D-C motorMABUCHI MOTOR CO·Filed 1992·Granted Dec 14, 1993·29 cites·13 claims
- 1863US9405769B2Searching for devices in an information technology environment with aid of mapsHAGIWARA KENJI·Filed 2014·Granted Aug 2, 2016·3 cites·17 claims
- 1961US7013250B2Simulator for automatic vehicle transmission controllersHONDA MOTOR CO LTD·Filed 2001·Granted Mar 14, 2006·10 cites·8 claims
- 2059US8982400B2Device management device and recording mediumRICOH CO LTD·Filed 2014·Granted Mar 17, 2015·0 cites·7 claims
- 2159US2022372274A1Resin composition for encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 2258US2015213381A1System, apparatus and method for performing enterprise analysis of information technology provisions and costsHAGIWARA KENJI·Filed 2014·Application pending·0 cites
- 2356US10600707B2Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipmentSHINETSU CHEMICAL CO·Filed 2018·Granted Mar 24, 2020·0 cites·20 claims
- 2452US10808102B2Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 20, 2020·0 cites·5 claims
- 2552US2023399467A1Resin composition for encapsulating semiconductor element-mounted surface of substrate with semiconductor element mounted thereon or semiconductor element-forming surface of wafer with semiconductor element formed thereon, and use thereofSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 2648US2008144099A1Image forming restriction control system, image forming restriction control method, and recording medium storing computer program for controlling restriction of image formingHAGIWARA KENJI·Filed 2007·Application pending·0 cites
- 2747US2017255978A1System, apparatus and method for generating a proposed state analysisHAGIWARA KENJI·Filed 2016·Application pending·0 cites
- 2847US2017270445A1System, apparatus and method for generating a proposed state based on a contractHAGIWARA KENJI·Filed 2016·Application pending·0 cites
- 2946US2017255984A1Generating proposed model list for proposed state analysisHAGIWARA KENJI·Filed 2016·Application pending·0 cites
- 3045US2023312909A1Thermosetting resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3143US6402661B2Apparatus for controlling an automatic transmissionHONDA MOTOR CO LTD·Filed 2000·Granted Jun 11, 2002·7 cites·2 claims
- 3242US2015220953A1Systems, apparatuses and methods for performing enterprise analysis and site analysis of information technology costsHAGIWARA KENJI·Filed 2014·Application pending·0 cites
- 3341US2019241696A1Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor apparatus, and method for manufacturing sameSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 3440US10380663B2System, application and method for generating proposed state to maintain total output volumesRICOH CO LTD·Filed 2016·Granted Aug 13, 2019·0 cites·13 claims
- 3540US2014222980A1Device management apparatus, system and method including remote configuration of device preference settingsHAGIWARA KENJI·Filed 2013·Application pending·0 cites
- 3638US2012127524A1Device management system, information processing device, information processing method, and recording mediumHAGIWARA KENJI·Filed 2011·Application pending·0 cites
- 3736US10157366B2System, application and method for generating proposed state floormapHAGIWARA KENJI·Filed 2016·Granted Dec 18, 2018·0 cites·18 claims
- 3836US5357159AMiniature motorMABUCHI MOTOR CO·Filed 1993·Granted Oct 18, 1994·7 cites·10 claims
- 3936US2017262867A1System, apparatus and method for automatically generating a proposed stateHAGIWARA KENJI·Filed 2016·Application pending·0 cites
- 4036US2021024749A1Heat-curable maleimide resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 4130US5502343AMiniature motorMABUCHI MOTOR CO·Filed 1994·Granted Mar 26, 1996·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →