Inventor · disambiguated record
Kevin Haley
Also filed as: HALEY KEVIN · HALEY KEVIN J
19 granted patents·1,027 citations·filing 1989–2003
96Inventor score
Files withINTEL CORP19
Top patents by PatentIndex Score
19 records- 0192US6667548B2Diamond heat spreading and cooling technique for integrated circuitsINTEL CORP·Filed 2001·Granted Dec 23, 2003·99 cites·20 claims
- 0291US5718282AHeat pipe exchanger system for cooling a hinged computing deviceINTEL CORP·Filed 1996·Granted Feb 17, 1998·64 cites·7 claims
- 0389US5506756ATape BGA package die-up/die downINTEL CORP·Filed 1995·Granted Apr 9, 1996·116 cites·4 claims
- 0488US7132313B2Diamond heat spreading and cooling technique for integrated circuitsINTEL CORP·Filed 2003·Granted Nov 7, 2006·66 cites·20 claims
- 0588US5646822AHeat pipe exchanger system for cooling a hinged computing deviceINTEL CORP·Filed 1995·Granted Jul 8, 1997·133 cites·7 claims
- 0685US5359768AMethod for mounting very small integrated circuit package on PCBINTEL CORP·Filed 1993·Granted Nov 1, 1994·79 cites·15 claims
- 0783US5621613AApparatus for dissipating heat in a hinged computing deviceINTEL CORP·Filed 1996·Granted Apr 15, 1997·118 cites·25 claims
- 0878US5966286ACooling system for thin profile electronic and computer devicesINTEL CORP·Filed 1996·Granted Oct 12, 1999·87 cites·19 claims
- 0969US5531021AMethod of making solder shape array packageINTEL CORP·Filed 1994·Granted Jul 2, 1996·43 cites·18 claims
- 1068US6181555B1Cooling system for integrated circuit chips in a portable computerINTEL CORP·Filed 1999·Granted Jan 30, 2001·54 cites·23 claims
- 1168US5982617ACooling system for integrated circuit chips in a portable computer lid assemblyINTEL CORP·Filed 1997·Granted Nov 9, 1999·55 cites·1 claims
- 1266US5006962AApparatus for surface mounting an integrated circuit packageINTEL CORP·Filed 1989·Granted Apr 9, 1991·24 cites·6 claims
- 1365US6404047B1Socketable BGA packageINTEL CORP·Filed 2000·Granted Jun 11, 2002·9 cites·12 claims
- 1463US6313987B1Thermal connector for joining mobile electronic devices to docking stationsINTEL CORP·Filed 1998·Granted Nov 6, 2001·42 cites·18 claims
- 1543US6043560AThermal interface thickness control for a microprocessorINTEL CORP·Filed 1997·Granted Mar 28, 2000·11 cites·11 claims
- 1641US6168976B1Socketable BGA packageINTEL CORP·Filed 1999·Granted Jan 2, 2001·7 cites·27 claims
- 1740US5290735AThin, high leadcount packageINTEL CORP·Filed 1993·Granted Mar 1, 1994·9 cites·23 claims
- 1839US5956229AInjection molded thermal interface systemINTEL CORP·Filed 1998·Granted Sep 21, 1999·8 cites·11 claims
- 1932US5359225AThin, high leadcount packageINTEL CORP·Filed 1992·Granted Oct 25, 1994·3 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Kevin Haley files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →