Inventor · disambiguated record
Keiichi Hasebe
Also filed as: HASEBE KEIICHI
4 granted patents·3 pending applications·0 citations·filing 2012–2022
52Inventor score
Top patents by PatentIndex Score
7 records- 0153US12325770B2Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2022·Granted Jun 10, 2025·0 cites·19 claims
- 0249US12384916B2Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2021·Granted Aug 12, 2025·0 cites·21 claims
- 0347US9905328B2Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the sameMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Feb 27, 2018·0 cites·16 claims
- 0443US2015034369A1Resin composition for printed wiring boardsKASHIMA NAOKI·Filed 2012·Application pending·0 cites
- 0539US9351397B2Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using sameMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted May 24, 2016·0 cites·18 claims
- 0636US2013040517A1Resin composition for printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2012·Application pending·0 cites
- 0733US2015140883A1Resin composition for printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →