Inventor · disambiguated record
Kenzo Hatada
Also filed as: HATADA KENZO · KAWAKAMI HAKUHEI
32 granted patents·1,564 citations·filing 1976–2002
98Inventor score
Top patents by PatentIndex Score
32 records- 0197US4749120AMethod of connecting a semiconductor device to a wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Jun 7, 1988·134 cites·5 claims
- 0295US5477087ABump electrode for connecting electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Dec 19, 1995·196 cites·4 claims
- 0393US5796714AOptical module having a vertical-cavity surface-emitting laserMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 18, 1998·114 cites·51 claims
- 0493US4996583AStack type semiconductor packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Feb 26, 1991·160 cites·5 claims
- 0592US4693770AMethod of bonding semiconductor devices togetherMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Sep 15, 1987·105 cites·16 claims
- 0687US4784972AMethod of joining beam leads with projections to device electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1987·Granted Nov 15, 1988·75 cites·10 claims
- 0786US6492255B2Semiconductor chip and method manufacturing the sameIBIDEN CO LTD·Filed 2001·Granted Dec 10, 2002·42 cites·65 claims
- 0885US5336547AElectronic components mounting/connecting package and its fabrication methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Aug 9, 1994·79 cites·4 claims
- 0984US5089772ADevice for testing semiconductor integrated circuits and method of testing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Feb 18, 1992·62 cites·9 claims
- 1079US5739053AProcess for bonding a semiconductor to a circuit substrate including a solder bump transferring stepMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Apr 14, 1998·82 cites·10 claims
- 1178US4494688AMethod of connecting metal leads with electrodes of semiconductor device and metal lead thereforeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1982·Granted Jan 22, 1985·44 cites·9 claims
- 1278US4293637AMethod of making metal electrode of semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1979·Granted Oct 6, 1981·42 cites·16 claims
- 1377US4098071ATime signal clockMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1976·Granted Jul 4, 1978·17 cites·11 claims
- 1476US6883933B2Lighting apparatus whose light emitting elements are hard to be taken offMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 26, 2005·23 cites·21 claims
- 1575US6917143B2Lighting apparatus with enhanced capability of removing heatMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jul 12, 2005·21 cites·19 claims
- 1671US5640044ASemiconductor device and method of producing said semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 17, 1997·40 cites·10 claims
- 1771US5233426AReduced diameter camera head for solid-state image pickup device and method of producing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Aug 3, 1993·33 cites·5 claims
- 1865US5998866ASemiconductor device having a lead clamping arrangementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 7, 1999·28 cites·13 claims
- 1963US5316204AMethod for bonding lead with electrode of electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted May 31, 1994·33 cites·8 claims
- 2060US5115545AApparatus for connecting semiconductor devices to wiring boardsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted May 26, 1992·34 cites·6 claims
- 2160US5089750ALead connection structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Feb 18, 1992·25 cites·13 claims
- 2259US5783463ASemiconductor device and method of producing said semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 21, 1998·22 cites·7 claims
- 2358US5776802ASemiconductor device and manufacturing method of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 7, 1998·21 cites·12 claims
- 2457US5316610ABonding apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted May 31, 1994·27 cites·8 claims
- 2555US4876221ABonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1988·Granted Oct 24, 1989·20 cites·2 claims
- 2650US6953991B2Semiconductor deviceSHINDO COMPANY LTD·Filed 2001·Granted Oct 11, 2005·6 cites·10 claims
- 2749US4766426ADisplay panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mountedMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Aug 23, 1988·16 cites·18 claims
- 2849US4684974AElectrode connection structure of flat deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1985·Granted Aug 4, 1987·16 cites·3 claims
- 2948US4176518AElectronic clock having audible time indicationMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1977·Granted Dec 4, 1979·5 cites·7 claims
- 3047US5012969AMethod of connecting electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted May 7, 1991·16 cites·5 claims
- 3146US4959590ALead connection structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Sep 25, 1990·14 cites·11 claims
- 3245US5665610ASemiconductor device checking methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Sep 9, 1997·12 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →