Inventor · disambiguated record
Kei Hayashi
Also filed as: HAYASHI KEI
8 granted patents·4 pending applications·22 citations·filing 2010–2024
80Inventor score
Top patents by PatentIndex Score
12 records- 0182US9568385B2Semiconductor pressure sensor, pressure sensor apparatus, electronic equipment, and method of manufacturing semiconductor pressure sensorROHM CO LTD·Filed 2014·Granted Feb 14, 2017·6 cites·7 claims
- 0282US8770035B2Semiconductor pressure sensor, pressure sensor apparatus, electronic equipment, and method of manufacturing semiconductor pressure sensorYAMADA NOBUYUKI·Filed 2010·Granted Jul 8, 2014·10 cites·20 claims
- 0374US2024404979A1Warpage control structure for metal base plate, semiconductor module, and inverter deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0463US9003883B2Angular velocity sensor and synchronous detection circuit used thereinHAYASHI KEI·Filed 2010·Granted Apr 14, 2015·3 cites·14 claims
- 0561US8816682B2Magnetic sensorHAYASHI KEI·Filed 2012·Granted Aug 26, 2014·2 cites·14 claims
- 0660US2024422914A1Semiconductor device, power conversion device, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0754US9843318B2Buffer circuitMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Dec 12, 2017·1 cites·3 claims
- 0852US2022157763A1Warpage control structure for metal base plate, semiconductor module, and inverter deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 0944US11450592B2Semiconductor package with a plurality of chips having a groove in the encapsulationMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 20, 2022·0 cites·20 claims
- 1041US11424398B2Thermoelectric conversion material and thermoelectric conversion moduleHITACHI LTD·Filed 2020·Granted Aug 23, 2022·0 cites·13 claims
- 1139US2018026170A1Thermoelectric material and method for producing thermoelectric materialUNIV TOHOKU·Filed 2017·Application pending·0 cites
- 1234US10193323B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jan 29, 2019·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →