Inventor · disambiguated record
Kengo Hirasawa
Also filed as: HIRASAWA KENGO
1 granted patent·3 pending applications·0 citations·filing 2022–2024
1Inventor score
Files withJSR CORP4
Top patents by PatentIndex Score
4 records- 0150US2024369931A1Method of manufacturing semiconductor substrate, method for forming resist underlayer film, and cleaning liquidJSR CORP·Filed 2024·Application pending·0 cites
- 0248US2024184203A1Composition for forming resist underlayer film, method for manufacturing semiconductor substrate, and method for forming resist underlayer filmJSR CORP·Filed 2024·Application pending·0 cites
- 0345US12353133B2Silicon-containing composition and method of producing semiconductor substrateJSR CORP·Filed 2022·Granted Jul 8, 2025·0 cites·19 claims
- 0439US2023093664A1Silicon-containing composition and method for manufacturing semiconductor substrateJSR CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →