Inventor · disambiguated record
Kean Seong Hooi
Also filed as: HOOI KEAN S · HOOI KEAN SEONG
3 granted patents·1 pending application·10 citations·filing 1999–2007
63Inventor score
Files withMOTOROLA INC4
Top patents by PatentIndex Score
4 records- 0168US7642136B2Method and apparatus for reducing stresses applied to bonded interconnects between substratesMOTOROLA INC·Filed 2007·Granted Jan 5, 2010·5 cites·9 claims
- 0243US6751461B1Apparatus and method for operating a communication unit using a default channelMOTOROLA INC·Filed 2000·Granted Jun 15, 2004·3 cites·8 claims
- 0341US2006163707A1Method and apparatus for reducing stresses applied to bonded interconnects between substratesMOTOROLA INC·Filed 2005·Application pending·0 cites
- 0417US6324066B1Surface mountable electronic deviceMOTOROLA INC·Filed 1999·Granted Nov 27, 2001·2 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →