Inventor · disambiguated record
Kenichi Hotehama
Also filed as: HOTEHAMA KENICHI
8 granted patents·3 pending applications·13 citations·filing 2007–2021
78Inventor score
Top patents by PatentIndex Score
11 records- 0175US8975626B2Flexible semiconductor deviceSUZUKI TAKESHI·Filed 2009·Granted Mar 10, 2015·6 cites·12 claims
- 0275US8895373B2Method for manufacturing flexible semiconductor device having gate electrode disposed within an opening of a resin filmPANASONIC CORP·Filed 2013·Granted Nov 25, 2014·3 cites·8 claims
- 0373US8581247B2Flexible semiconductor device having gate electrode disposed within an opening of a resin filmSUZUKI TAKESHI·Filed 2010·Granted Nov 12, 2013·3 cites·16 claims
- 0466US2021242448A1Battery negative electrode material, method for manufacturing same, negative electrode for secondary battery, and secondary batteryKUREHA CORP·Filed 2021·Application pending·0 cites
- 0562US2019221835A1Battery negative electrode material, method for manufacturing same, negative electrode for secondary battery, and secondary batteryKUREHA CORP·Filed 2019·Application pending·0 cites
- 0657US10483594B2Positive electrode plates for nonaqueous electrolyte secondary batteries, and nonaqueous electrolyte secondary batteriesPANASONIC CORP·Filed 2015·Granted Nov 19, 2019·0 cites·9 claims
- 0754US8887383B2Electrode structure and method for forming bumpTANIGUCHI YASUSHI·Filed 2007·Granted Nov 18, 2014·1 cites·12 claims
- 0851US10424785B2Negative electrode material including composite particles, and method for producing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 24, 2019·0 cites·9 claims
- 0949US10644310B2Negative electrode material including composite particles, and method for producing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted May 5, 2020·0 cites·5 claims
- 1048US2009008776A1Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing MethodKITAE TAKASHI·Filed 2007·Application pending·0 cites
- 1141US8297488B2Bump forming method using self-assembling resin and a wall surfaceKARASHIMA SEIJI·Filed 2007·Granted Oct 30, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →