Inventor · disambiguated record
Keng-Wei Hsu
Also filed as: HSU KENG-WEI
1 granted patent·3 pending applications·0 citations·filing 2017–2024
2Inventor score
Top patents by PatentIndex Score
4 records- 0161US2025250405A1Expandable resin particle, expanded resin particle, foamed resin molded article and manufacturing method thereofLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 0259US2024110030A1Expandable resin particle, expanded resin particle, foamed resin molded article and manufacturing method thereofLCY CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 0339US2022159665A1Wireless communication method, base station device and base station systemINST INFORMATION IND·Filed 2020·Application pending·0 cites
- 0428US10331789B2Semantic analysis apparatus, method, and non-transitory computer readable storage medium thereofINST INFORMATION IND·Filed 2017·Granted Jun 25, 2019·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →