Inventor · disambiguated record
Ke-Fang Hsu
Also filed as: HSU KE-FANG
1 granted patent·1 pending application·0 citations·filing 2022–2025
13Inventor score
Technology areasH10W
Files withVANGUARD INT SEMICONDUCT CORP2
Top patents by PatentIndex Score
2 records- 0175US2025357159A1Methods of transferring dies and die bonded structuresVANGUARD INT SEMICONDUCT CORP·Filed 2025·Application pending·0 cites
- 0265US12400883B2Structure of transferring dies for use in mass transferring processVANGUARD INT SEMICONDUCT CORP·Filed 2022·Granted Aug 26, 2025·0 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Ke-Fang Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →