Inventor · disambiguated record
Kevin W. Hutto
Also filed as: HUTTO KEVIN · HUTTO KEVIN W
11 granted patents·49 citations·filing 2006–2016
87Inventor score
Files withHUTTO KEVIN W4MICRON TECHNOLOGY INC3BORTHAKUR SWARNAL1HUTTO KEVIN1SEMICONDUCTOR COMPONENTS IND1
Top patents by PatentIndex Score
11 records- 0185US7560371B2Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuumMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 14, 2009·14 cites·32 claims
- 0283US8697473B2Methods for forming backside illuminated image sensors with front side metal redistribution layersBORTHAKUR SWARNAL·Filed 2011·Granted Apr 15, 2014·6 cites·9 claims
- 0375US8314498B2Isolated bond pad with conductive via interconnectHUTTO KEVIN·Filed 2010·Granted Nov 20, 2012·6 cites·15 claims
- 0473US8794050B2Fluid sample analysis systemsHUTTO KEVIN W·Filed 2011·Granted Aug 5, 2014·2 cites·18 claims
- 0569US7928582B2Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpiecesMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 19, 2011·17 cites·22 claims
- 0664US9362330B2Methods for forming backside illuminated image sensors with front side metal redistribution layers and a permanent carrier layerSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jun 7, 2016·1 cites·12 claims
- 0760US8221557B2Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processesHUTTO KEVIN W·Filed 2007·Granted Jul 17, 2012·1 cites·21 claims
- 0856US8492198B2Microelectronic workpieces with stand-off projections and methods for manufacturing microelectronic devices using such workpiecesHUTTO KEVIN W·Filed 2011·Granted Jul 23, 2013·2 cites·18 claims
- 0953US9666638B2Methods for forming backside illuminated image sensors with front side metal redistribution layersSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 30, 2017·0 cites·20 claims
- 1049US8568535B2Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processesHUTTO KEVIN W·Filed 2012·Granted Oct 29, 2013·0 cites·28 claims
- 1146US8987874B2Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpiecesMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 24, 2015·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →