Inventor · disambiguated record
Keiichi Ibata
Also filed as: IBATA KEIICHI
5 granted patents·9 pending applications·0 citations·filing 2019–2024
59Inventor score
Files withTOKYO OHKA KOGYO CO LTD14
Top patents by PatentIndex Score
14 records- 0168US11921425B2Hard mask-forming composition and method for manufacturing electronic componentTOKYO OHKA KOGYO CO LTD·Filed 2023·Granted Mar 5, 2024·0 cites·8 claims
- 0268US2025208507A1Film-forming composition, method for producing cured film, cage-type silsesquioxane, and cyclic siloxaneTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 0366US2025208508A1Film-forming composition, method for producing cured film, and cage-type silsesquioxaneTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 0463US2024295814A1Resist composition, resist pattern forming method, and polymerTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 0560US2023314945A1Negative-tone resist composition and method of forming resist patternTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 0660US2024118619A1Resist composition and resist pattern forming methodTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 0759US2024329534A1Film-forming composition, resist pattern formation method, and polyhedral oligomeric silsesquioxaneTOKYO OHKA KOGYO CO LTD·Filed 2024·Application pending·0 cites
- 0859US2021382392A1Hard-mask forming composition and method for manufacturing electronic componentTOKYO OHKA KOGYO CO LTD·Filed 2021·Application pending·0 cites
- 0956US11650503B2Hard mask-forming composition and method for manufacturing electronic componentTOKYO OHKA KOGYO CO LTD·Filed 2019·Granted May 16, 2023·0 cites·8 claims
- 1052US2025130498A1Resist underlayer film formation composition, resist pattern formation method, formation method for resist underlayer film pattern, and pattern formation methodTOKYO OHKA KOGYO CO LTD·Filed 2022·Application pending·0 cites
- 1149US11746189B2Hard-mask forming composition, method for manufacturing electronic component, and resinTOKYO OHKA KOGYO CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·8 claims
- 1246US12221556B2Hard-mask forming composition, method for manufacturing electronic component, and compound and resinTOKYO OHKA KOGYO CO LTD·Filed 2020·Granted Feb 11, 2025·0 cites·13 claims
- 1345US11248086B2Hard-mask forming composition and method for manufacturing electronic componentTOKYO OHKA KOGYO CO LTD·Filed 2019·Granted Feb 15, 2022·0 cites·6 claims
- 1443US2021132498A1Hard-mask forming composition and method for manufacturing electronic componentTOKYO OHKA KOGYO CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →