Inventor · disambiguated record
Keitaro Ichikawa
Also filed as: ICHIKAWA KEITARO
9 granted patents·4 pending applications·6 citations·filing 2014–2023
76Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP13
Top patents by PatentIndex Score
13 records- 0177US9627302B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 18, 2017·5 cites·8 claims
- 0262US2023335480A1Power semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0361US12444666B2Semiconductor device with bent terminalsMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Oct 14, 2025·0 cites·13 claims
- 0459US10930523B2Method for manufacturing resin-sealed power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 23, 2021·1 cites·7 claims
- 0557US12211764B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Jan 28, 2025·0 cites·8 claims
- 0653US11652032B2Semiconductor device having inner lead exposed from sealing resin, semiconductor device manufacturing method thereof, and power converter including the semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted May 16, 2023·0 cites·18 claims
- 0752US11735509B2Power semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 22, 2023·0 cites·3 claims
- 0852US2024234260A9Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0949US2023238311A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1047US2024266194A1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1142US11335629B2Transfer-mold type power module and lead frameMITSUBISHI ELECTRIC CORP·Filed 2020·Granted May 17, 2022·0 cites·3 claims
- 1238US11244836B2Semiconductor apparatus, power conversion device, and method for manufacturing semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Feb 8, 2022·0 cites·20 claims
- 1336US10074598B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 11, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →