Inventor · disambiguated record
Kenji Iketaki
Also filed as: IKETAKI KENJI
6 granted patents·1 pending application·50 citations·filing 1995–2007
80Inventor score
Files withFUJITSU LTD7
Top patents by PatentIndex Score
7 records- 0169US6541898B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2001·Granted Apr 1, 2003·14 cites·7 claims
- 0266US7759613B2Reflowing apparatus and reflowing methodFUJITSU LTD·Filed 2007·Granted Jul 20, 2010·2 cites·14 claims
- 0366US6467141B2Method of assembling micro-actuatorFUJITSU LTD·Filed 2001·Granted Oct 22, 2002·12 cites·14 claims
- 0459US5560534ASoldering apparatusFUJITSU LTD·Filed 1995·Granted Oct 1, 1996·20 cites·18 claims
- 0547US6744183B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2003·Granted Jun 1, 2004·2 cites·2 claims
- 0638US6787711B2Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board deviceFUJITSU LTD·Filed 2002·Granted Sep 7, 2004·0 cites·10 claims
- 0738US2006007661A1Circuit boardFUJITSU LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →