Inventor · disambiguated record
Kei Imafuji
Also filed as: IMAFUJI KEI
14 granted patents·1 pending application·61 citations·filing 2003–2021
88Inventor score
Files withSHINKO ELECTRIC IND CO15
Top patents by PatentIndex Score
15 records- 0186US9485864B2Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing methodSHINKO ELECTRIC IND CO·Filed 2014·Granted Nov 1, 2016·10 cites·3 claims
- 0285US7093356B2Method for producing wiring substrateSHINKO ELECTRIC IND CO·Filed 2003·Granted Aug 22, 2006·38 cites·13 claims
- 0383US9935043B1Interconnection substrate and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2017·Granted Apr 3, 2018·3 cites·6 claims
- 0473US7264848B2Non-cyanide electroless gold plating solution and process for electroless gold platingSHINKO ELECTRIC IND CO·Filed 2005·Granted Sep 4, 2007·2 cites·5 claims
- 0571US9899304B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Feb 20, 2018·2 cites·12 claims
- 0667US10438883B2Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Oct 8, 2019·1 cites·21 claims
- 0762US7901997B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Mar 8, 2011·2 cites·6 claims
- 0858US9210807B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Dec 8, 2015·1 cites·9 claims
- 0957US2007029206A1Non-cyanogen type electrolytic solution for plating goldSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 1056US7261803B2Non-cyanogen type electrolytic solution for plating goldSHINKO ELECTRIC IND CO·Filed 2003·Granted Aug 28, 2007·2 cites·5 claims
- 1153US11605585B2Flexible substrate and semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2021·Granted Mar 14, 2023·0 cites·9 claims
- 1250US12057384B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2021·Granted Aug 6, 2024·0 cites·8 claims
- 1349US9084339B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 14, 2015·0 cites·9 claims
- 1443US7807560B2Solder bump forming methodSHINKO ELECTRIC IND CO·Filed 2008·Granted Oct 5, 2010·0 cites·7 claims
- 1534US9545016B2Wiring substrate and method for manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 10, 2017·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →