Inventor · disambiguated record
Kei Itagaki
Also filed as: ITAGAKI Kei
3 granted patents·7 pending applications·0 citations·filing 2020–2024
41Inventor score
Top patents by PatentIndex Score
10 records- 0168US2024371832A1Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method thereforRESONAC CORP·Filed 2024·Application pending·0 cites
- 0265US2025293105A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0365US2025259859A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0461US2025287514A1Method for manufacturing electronic component deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0553US12074139B2Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method thereforRESONAC CORP·Filed 2020·Granted Aug 27, 2024·0 cites·4 claims
- 0647US2025167034A1Integrated dicing/die bonding film, method for producing same, and method for producing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0743US11935870B2Method for manufacturing semiconductor device having dolmen structure, method for manufacturing support piece, and laminated filmRESONAC CORP·Filed 2020·Granted Mar 19, 2024·0 cites·15 claims
- 0840US2024043722A1Film-like adhesive agent, dicing/die-bonding all-in-one film, semiconductor device, and method for manufacturing sameRESONAC CORP·Filed 2021·Application pending·0 cites
- 0939US12482707B2Method of manufacturing semiconductor device and colletRESONAC CORP·Filed 2020·Granted Nov 25, 2025·0 cites·15 claims
- 1035US2023395420A1Film adhesive and method for making same; dicing/die bonding integrated film and method for making same; and semiconductor device and method for making sameSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →