Inventor · disambiguated record
Keon-Soo Jang
Also filed as: JANG KEON-SOO
1 granted patent·1 pending application·6 citations·filing 2018–2024
28Inventor score
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2 records- 0188US10636761B2Method of fabricating a semiconductor packageELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Apr 28, 2020·6 cites·11 claims
- 0245US2025024655A1Hexagonal double-layer ultrawideband electromagnetic wave absorberINDUSTRY UNIV COOPERATION OF USW·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →