Inventor · disambiguated record
Kenji Kagata
Also filed as: KAGATA KENJI
4 granted patents·201 citations·filing 1993–2003
81Inventor score
Files withMITSUBISHI ELECTRIC CORP4
Top patents by PatentIndex Score
4 records- 0194US6633078B2Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminalMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 14, 2003·108 cites·15 claims
- 0275US5821762ASemiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrateMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Oct 13, 1998·52 cites·18 claims
- 0370US6905911B2Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminalMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jun 14, 2005·14 cites·4 claims
- 0453US5773879ACu/Mo/Cu clad mounting for high frequency devicesMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jun 30, 1998·27 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →