Inventor · disambiguated record
Kei Kanemoto
Also filed as: KANEMOTO KEI
34 granted patents·22 pending applications·97 citations·filing 2003–2024
96Inventor score
Top patents by PatentIndex Score
56 records- 0189US8736254B2Physical quantity sensor and electronic apparatusKANEMOTO KEI·Filed 2011·Granted May 27, 2014·8 cites·15 claims
- 0288US11262315B2Attached substance determination method, attached substance determination device, and non-transitory computer-readable storage medium storing attached substance determination programSEIKO EPSON CORP·Filed 2020·Granted Mar 1, 2022·2 cites·5 claims
- 0386US10302672B2Angular velocity detection circuit, angular velocity detection device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2017·Granted May 28, 2019·5 cites·12 claims
- 0485US9038461B2Gyro sensor and electronic deviceKANEMOTO KEI·Filed 2012·Granted May 26, 2015·12 cites·9 claims
- 0582US10697773B2Physical quantity sensor, method for manufacturing physical quantity sensor, physical quantity sensor device, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2018·Granted Jun 30, 2020·3 cites·19 claims
- 0680US9470525B2Gyro sensor and electronic apparatusSEIKO EPSON CORP·Filed 2013·Granted Oct 18, 2016·7 cites·16 claims
- 0780US9157927B2Physical quantity sensor and electronic apparatusSEIKO EPSON CORP·Filed 2014·Granted Oct 13, 2015·3 cites·8 claims
- 0878US8338896B2MEMS sensor, MEMS sensor manufacturing method, and electronic deviceKANEMOTO KEI·Filed 2010·Granted Dec 25, 2012·5 cites·9 claims
- 0978US7396733B2Method for manufacturing semiconductor substrate and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Jul 8, 2008·8 cites·8 claims
- 1075US7326603B2Semiconductor device, method of manufacturing semiconductor substrate, and method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2005·Granted Feb 5, 2008·6 cites·10 claims
- 1174US10823570B2Physical quantity sensor, physical quantity sensor device, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2018·Granted Nov 3, 2020·1 cites·6 claims
- 1274US7495287B2Semiconductor device and manufacturing method thereofSEIKO EPSON CORP·Filed 2007·Granted Feb 24, 2009·6 cites·16 claims
- 1372US7271447B2Semiconductor deviceSEIKO EPSON CORP·Filed 2005·Granted Sep 18, 2007·5 cites·2 claims
- 1470US7465641B2Method for manufacturing a semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Dec 16, 2008·5 cites·4 claims
- 1569US7294539B2Semiconductor substrate, semiconductor device, method of manufacturing semiconductor substrate, and method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Nov 13, 2007·3 cites·4 claims
- 1667US2024248026A1Spectral image analysis method, spectral image analysis program, and spectral image analysis deviceSEIKO EPSON CORP·Filed 2024·Application pending·0 cites
- 1766US7938506B2Inkjet recording head, inkjet recording device, and method for manufacturing the inkjet recording headSEIKO EPSON CORP·Filed 2009·Granted May 10, 2011·2 cites·6 claims
- 1865US7452781B2Method for manufacturing a semiconductor substrate, method for manufacturing a semiconductor device, and the semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Nov 18, 2008·3 cites·2 claims
- 1961US7524705B2Method for manufacturing a semiconductor substrate and method for manufacturing a semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Apr 28, 2009·2 cites·4 claims
- 2061US7425495B2Method of manufacturing semiconductor substrate and semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Sep 16, 2008·2 cites·5 claims
- 2159US12467789B2Information processing device, information processing system, and information processing methodSEIKO EPSON CORP·Filed 2022·Granted Nov 11, 2025·0 cites·9 claims
- 2259US6927110B2Method of manufacturing a semiconductor deviceSEIKO EPSON CORP·Filed 2003·Granted Aug 9, 2005·8 cites·5 claims
- 2358US9243908B2Gyro sensor and electronic apparatusSEIKO EPSON CORP·Filed 2013·Granted Jan 26, 2016·1 cites·13 claims
- 2451US7622359B2Method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2008·Granted Nov 24, 2009·0 cites·8 claims
- 2547US9389078B2Gyro sensor and electronic apparatusSEIKO EPSON CORP·Filed 2013·Granted Jul 12, 2016·0 cites·14 claims
- 2647US8037604B2Method of manufacturing ink jet recording headSEIKO EPSON CORP·Filed 2009·Granted Oct 18, 2011·0 cites·6 claims
- 2747US2008206953A1Method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 2846US10670428B2Circuit device, physical quantity detection device, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2017·Granted Jun 2, 2020·0 cites·12 claims
- 2946US10627234B2Gyro sensor, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2018·Granted Apr 21, 2020·0 cites·11 claims
- 3046US7569438B2Method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2007·Granted Aug 4, 2009·0 cites·8 claims
- 3146US2018369863A1Vibration device, vibration device module, electronic device, and vehicleSEIKO EPSON CORP·Filed 2018·Application pending·0 cites
- 3245US7625784B2Semiconductor device and method for manufacturing thereofSEIKO EPSON CORP·Filed 2007·Granted Dec 1, 2009·0 cites·4 claims
- 3345US2008045023A1Method for manufacturing semiconductor device, and semiconductor deviceSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 3444US7507643B2Method for manufacturing semiconductor substrate, method for manufacturing semiconductor device, and semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Mar 24, 2009·0 cites·5 claims
- 3544US7488666B2Method for manufacturing semiconductor substrate and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Feb 10, 2009·0 cites·3 claims
- 3644US2007262380A1Semiconductor device and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 3744US2019113341A1Physical Quantity Sensor, Inertial Measurement Device, Vehicle Positioning Device, Portable Electronic Apparatus, Electronic Apparatus, And VehicleSEIKO EPSON CORP·Filed 2018·Application pending·0 cites
- 3843US2007138512A1Semiconductor substrate manufacturing method and semiconductor deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 3943US2007045657A1Semiconductor substrate, semiconductor device, manufacturing method thereof, and method for designing semiconductor substrateSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 4043US2008237778A1Semiconductor device and method for manufacturing the sameSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 4142US9273962B2Physical quantity sensor and electronic deviceKANEMOTO KEI·Filed 2012·Granted Mar 1, 2016·0 cites·13 claims
- 4242US2007004212A1Method for manufacturing a semiconductor substrate and method for manufacturing a semiconductor deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 4342US2007018246A1Semiconductor device and semiconductor device manufacturing methodTOKYO INST TECH·Filed 2006·Application pending·0 cites
- 4441US2017254644A1Drive circuit, angular velocity detection device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2017·Application pending·0 cites
- 4541US2017254645A1Angular velocity detection circuit, angular velocity detection device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2017·Application pending·0 cites
- 4640US9970763B2Gyro sensor, electronic device, mobile apparatus, and manufacturing method of gyro sensorSEIKO EPSON CORP·Filed 2016·Granted May 15, 2018·0 cites·8 claims
- 4740US2007102735A1Semiconductor device and method for manufacturing the semiconductor deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 4840US2010242606A1Mems sensor, mems sensor manufacturing method, and electronic deviceSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
- 4940US2005176220A1Semiconductor device and method for manufacturing thereofFiled 2004·Application pending·0 cites
- 5040US2011049653A1Mems sensor, electronic device, and method of manufacturing mems sensorSEIKO EPSON CORP·Filed 2010·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →