Inventor · disambiguated record
Keon Teak Kang
Also filed as: KANG KEON TEAK
2 granted patents·1 pending application·23 citations·filing 2005–2007
57Inventor score
Technology areasH10W
Files withSTATS CHIPPAC LTD3
Top patents by PatentIndex Score
3 records- 0186US7445962B2Stacked integrated circuits package system with dense routability and high thermal conductivitySTATS CHIPPAC LTD·Filed 2005·Granted Nov 4, 2008·21 cites·20 claims
- 0259US8008787B2Integrated circuit package system with delamination prevention structureSTATS CHIPPAC LTD·Filed 2007·Granted Aug 30, 2011·2 cites·18 claims
- 0340US2007001296A1Bump for overhang deviceSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →