Inventor · disambiguated record
Keiko Kashihara
Also filed as: KASHIHARA KEIKO
13 granted patents·5 pending applications·65 citations·filing 1990–2023
86Inventor score
Files withPANASONIC IP MAN CO LTD6MATSUSHITA ELECTRIC WORKS LTD4PANASONIC CORP2AJINOMOTO KK1INOUE HIROHARU1
Top patents by PatentIndex Score
18 records- 0184US10371612B2Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board materialPANASONIC IP MAN CO LTD·Filed 2016·Granted Aug 6, 2019·2 cites·11 claims
- 0269US6143369AProcess of impregnating substrate and impregnated substrateMATSUSHITA ELECTRIC WORKS LTD·Filed 1996·Granted Nov 7, 2000·39 cites·17 claims
- 0368US12031708B2Elastic resin sheet having light-diffusing portion, and light-emitting sheet using same preliminary classPANASONIC IP MAN CO LTD·Filed 2023·Granted Jul 9, 2024·0 cites·16 claims
- 0460US9082825B2Manufacturing method for semiconductor package, semiconductor package, and semiconductor devicePANASONIC CORP·Filed 2012·Granted Jul 14, 2015·1 cites·19 claims
- 0556US6403690B1Flame retardant resin compositionMATSUSHITA ELECTRIC WORKS LTD·Filed 1999·Granted Jun 11, 2002·13 cites·12 claims
- 0654US2023301047A1Electromagnetic wave absorbing sheetPANASONIC HOLDINGS CORP·Filed 2023·Application pending·0 cites
- 0750US11407869B2Prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 9, 2022·0 cites·9 claims
- 0850US5279895APolyimide composition and prepreg and laminate thereofMATSUSHITA ELECTRIC WORKS LTD·Filed 1992·Granted Jan 18, 1994·10 cites·6 claims
- 0949US2009023351A1Flame-retardant resin composition, prepreg, resin sheet, and moldingKASHIHARA KEIKO·Filed 2006·Application pending·0 cites
- 1048US2005084601A1Pumpkin for cooking use and process for producing the sameAJINOMOTO KK·Filed 2003·Application pending·0 cites
- 1147US11059260B2Prepreg, metal-clad laminated board, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Jul 13, 2021·0 cites·16 claims
- 1246US11234329B2Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jan 25, 2022·0 cites·6 claims
- 1346US9894761B2Prepreg, metal-clad laminated plate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 13, 2018·0 cites·7 claims
- 1445US9669567B2Manufacturing method of molded articlePANASONIC CORP·Filed 2014·Granted Jun 6, 2017·0 cites·5 claims
- 1543US9528026B2Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring boardSAGARA TAKASHI·Filed 2012·Granted Dec 27, 2016·0 cites·21 claims
- 1638US2013126217A1Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring boardYAMAGUCHI MAO·Filed 2011·Application pending·0 cites
- 1735US2010233486A1Flame-retardant resin composition, and prepreg, resin sheet and molded article using the sameINOUE HIROHARU·Filed 2007·Application pending·0 cites
- 1826US5136015AAddition type imide resin prepolymer, manufacturing method thereof, prepreg and laminate thereofMATSUSHITA ELECTRIC WORKS LTD·Filed 1990·Granted Aug 4, 1992·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →